Influence of permanent magnet stirring on dendrite morphological and elastic properties of a novel Sn–Ag–Cu–Sb–Al solder alloy by ultrasonic pulse echo method

El-Taher, A. M.; Azeem, S. E. Abd El; Ibrahiem, A.A.

doi:10.1007/s10854-020-03506-4

Cited by 6 publications

(7 citation statements)

References 40 publications

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“…The cylindrical rods were then mechanically machined into wire samples of 0.9 mm diameter for mechanical examination. To reduce internal stresses introduced during the cold drawing process and stabilize the microstructure, all samples were heat treated for 60 min at 160 °C and then allowed to cool gradually to room temperature [39]. A cooling rate of 8 °C-10 °C s −1 was achieved for all previous heat processes, to provide the fine microstructure commonly present in small solder joints in microelectronic packages.…”

Section: Methodsmentioning

confidence: 99%

Correlation of microstructure with thermal and tensile creep properties of novel Sn-5Sb-0.5Cu alloy reinforced with Co particles for soldering applications

Mousa,

Sobhy,

Mahmoud

2024

Phys. Scr.

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The present research examined how cobalt microalloying additions of 0.25, 0.5, 0.75, and 1 weight percent affected the microstructural properties, thermal features, and tensile creep characteristics of eutectic Sn-5 wt.% Sb- 0.5 wt.% Cu (SSC) lead-free solder alloy. According to the results, cobalt additions of 0.25, 0.5, and 0.75 wt.% did not affect SbSn phase but significantly refined β-Sn grains, facilitating the formation of fine fibers (Cu,Co)6Sn5 together with plate-like CoSn3 phases, and preventing the formation of Cu6Sn5 phases. Furthermore, a large amount of cobalt (1wt.%) addition accumulated in the coarsening of the CoSn3 phase. Additions of 0.25 wt.% Co, 0.75 wt.% Co, and 1wt.% Co did not affect the melting temperatures, but pasty ranges had been slightly lowered, which may enhance the thermal characteristics. Addition of 0.5 wt.% Co had unfavorable effects on both melting point and pasty range. This has significant effects on solder reliability and electronic service performance. In terms of creep behavior, the SSC-0.75 wt.% Co specimens displayed the highest creep resistance because of the fine dispersion of intermetallic compounds (IMCs) and extended the creep-rupture life to a level that is 3.0 times greater than the SSC baseline. Lower creep resistance was observed in SSC-0.25 wt.% Co specimens, which was mostly due to the smaller volume fraction of the precipitate phases and the absence of the CoSn3 phase. Depending on the determined stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SSC-xCo solders is the dislocation climb controlled by short-circuit pipe diffusion across the whole temperature range that was examined.

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Section: Methodsmentioning

confidence: 99%

Correlation of microstructure with thermal and tensile creep properties of novel Sn-5Sb-0.5Cu alloy reinforced with Co particles for soldering applications

Mousa,

Sobhy,

Mahmoud

2024

Phys. Scr.

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“…The cylindrical rods were then mechanically pulled into specimens of 4 cm gauge length and 0.8 mm diameter for mechanical and thermal investigation. Finally, all specimens were heat-treated at 120 °C for 50 min to diminish internal stresses [31].…”

Section: Sample Preparationmentioning

confidence: 99%

Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy

El-Taher

Elmoniem²,

Mosaad

2023

J Mater Sci: Mater Electron

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This study investigated the effects of cobalt microalloying addition on the microstructural features, thermal characteristics and mechanical behavior of eutectic Sn–0.7wt%Cu lead-free solder alloys. The results show that minor cobalt addition of ~ 0.05 wt% causes significant grain refinement of β-Sn, facilitates the formation of fine fibers (Cu,Co)6Sn5 phases and preventing the formation of η′-Cu6Sn5 phases, whereas a large amount of Co (~ 0.5 wt%) additions accumulated in the (Cu,Co)6Sn5 IMCs and clearly changed into coarse fibers. The precipitation strengthening mechanisms of fine fibers (Cu,Co)6Sn5 in the β-Sn matrix increased the ultimate tensile strength (UTS) and Young’s modulus (Y) of the alloy from 30.5 MPa and 15 GPa to 44.6 MPa and 22.3 GPa, respectively, but the ductility decreased from 60 to 45.7%. The coarse fibers (Cu,Co)6Sn5 in eutectic alloys is of interest from not only increased UTS and Y to 38.7 MPa and 16.3 GPa but also maintaining the ductility at the same level, allowing for unique microstructure design. Furthermore, 0.05wt% of Co significantly reduce the onset, eutectic temperatures and undercooling, although pasty rang has been slightly raised, which may enhance the thermal characteristics. This presumably has important implications for the reliability of solders as well as their performance in electronic service.

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“…3 Experimental findings and discussions The qualitative analyses can be explained as follows; the non-contact RMF could enhance the heat transfer from the melt to the environment, which significantly increases the cooling rate and thus affect the grain growth of b-Sn and accelerated the growth rate of the IMCs [25][26][27][28][29][30]. Due to the prolongation of the RMF processing until complete solidification of the sample, IMCs became thicker as shown in Fig.…”

Section: Materials and Experimental Proceduresmentioning

confidence: 99%

“…Excellent shock reliability with enhanced yield strength, tensile strength, and elongation has been obtained with the addition of Al as illustrated by Maslinda et al [24]. Another attractive technique is the application of rotating magnetic field (RMF) during solidification of metallic alloys in order to enhance the drop resistance of the solder joints [25][26][27][28][29]. The RMF could have an effect on the flow and solidification actions of molten metal by producing Lorentz forces and thus could have an impact on microstructure and performance [30][31][32].…”

Section: Introductionmentioning

confidence: 99%

Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field

El-Taher

Azeem

Ibrahiem

2021

J Mater Sci: Mater Electron

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The main scope of this research is to investigate the impact of rotating magnetic field (RMF) on the physical properties of the Sn-0.5Ag-0.5Cu-2.0Sb-0.1Al (SAC0505SbAl) solder alloy. The application of RMF during molten alloy cooling showed prominent effect on the morphology, thermal properties, and the consequent mechanical characteristics. It was shown that the dendritic morphology was changed from columnar dendrites to equiaxed grains with the application of RMF. In addition, RMF processing modified the eutectic phases in the alloy matrix. These notable modifications have resulted in a substantial increase in ductility (* 30%) with a slight decrease in tensile parameters (UTS and YS). Such effects could enhance elastic compliance and plastic energy dissipation ability of solder alloys, which plays superbly fundamental function in drop-impact reliability. Differential scanning calorimetry (DSC) analysis reveals that significant decrease in pasty range (from 10.8 to 7.5°C) and undercooling (from 13.1 to 9.0°C) was attained after applying RMF. The stress exponent (n), the activation energy (Q), and deformation mechanism of the SAC0505SbAl alloy processed with and without RMF were discussed in detail. The obtained results are certainly expected to fill the knowledge gap about the behavior of these recently developed solder alloys under the effect of RMF that are potential alternatives as Pb-free interconnecting material in microelectronic packaging industry.

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Influence of permanent magnet stirring on dendrite morphological and elastic properties of a novel Sn–Ag–Cu–Sb–Al solder alloy by ultrasonic pulse echo method

Cited by 6 publications

References 40 publications

Correlation of microstructure with thermal and tensile creep properties of novel Sn-5Sb-0.5Cu alloy reinforced with Co particles for soldering applications

Correlation of microstructure with thermal and tensile creep properties of novel Sn-5Sb-0.5Cu alloy reinforced with Co particles for soldering applications

Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy

Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field

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