Influences of Operated Temperature on Bending Strain on Cyclic Motion of La-Ni Alloy Thin Film Driven by Hydrogenation

Abstract

Hydrogenation operates the bending motion of mover device, which is a platinum coated La Ni alloy film deposited on a polyimide sheet, has been successfully developed. Influence of the operating temperature on the motion strain has been evaluated. When the operating temperature is 373 K, the maximum value of bending strain (De) is 408 ppm, which is 1.4 times larger than that (300 ppm) of an unheated film operated at 323 K.

Thermal conductivity of diamond particle dispersed aluminum matrix composites fabricated in solid–liquid co-existent state by SPS

“…High-performance thermal management materials should have high thermal conductivities [1][2][3] and low coefficients of thermal expansion (CTEs) for maximizing heat dissipation and minimizing thermal stress and warping, which are critical issues in packaging of microprocessors, power semiconductors, high-power laser diodes, light-emitting diodes (LEDs), and micro-electro-mechanical systems (MEMs) [4][5][6][7]. Thermal stress and warping arise from CTE differences, which become significant in advanced electronic devices because of high heat generated, for example, when highpower laser diodes or high integration level of ICs are in use.…”