“…Hence the use of copper nitride in write-once memory devices [23,24,25,26,27], as a seed layer for electrodeposition [28] and in optical lithography for fabrication of metal links [29,30] was proposed. At the same time, bulk material is stable at room temperature, but decomposes at 300-450 • C. Other possible applications of Cu 3 N are related to spintronics [31,32], electrocatalysis [33], solar energy conversion [19,34], resistive switching memories [35,36] and inorganic-organic electronics [37].…”