2015
DOI: 10.1109/jdt.2015.2405135
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Inkjet Printing Design Rules Formalization and Improvement

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Cited by 21 publications
(11 citation statements)
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“…All the patterning steps were performed by using inkjet printing . For substrate preparation, a heavily doped p‐type silicon wafer with 300 nm oxide layer was cleaned with acetone and 2‐propanol and treated with UV–ozone for 5 min.…”
Section: Methodsmentioning
confidence: 99%
“…All the patterning steps were performed by using inkjet printing . For substrate preparation, a heavily doped p‐type silicon wafer with 300 nm oxide layer was cleaned with acetone and 2‐propanol and treated with UV–ozone for 5 min.…”
Section: Methodsmentioning
confidence: 99%
“…They investigated massive device failure cases and their origins . Mashayekhi et al (2015) proposed an advanced method that automatically extracts inkjet design rules by using parameterized printed patterns . Vila et al (2016) demonstrated complete characterization and automated extraction of key technology parameters using a compensation technique for inkjet pattern generation. , In 2017, Ramon et al expanded their work to include the development of a simple manufacturing process for all-inkjet-printed organic ICs with a maximum TFT yield of 81% .…”
Section: Related Workmentioning
confidence: 99%
“…An alternative technique to improve the printing quality for complex layouts (layouts containing multi-lines, crossings, junctions or multilayer systems) is the implementation of design kits by optical evaluation [14][15][16], showing the problems of such layouts and using pattern compensation as a possible solution for the specific ink/substrate combinations. A method to create a design kit for inkjet printing of a 4-layer (metal, dielectric, metal, and organic semiconductor) design is displayed in [17]. Layout features such as line width, spacing, corner distances and overlapping can be evaluated electrically and optically.…”
Section: Introductionmentioning
confidence: 99%