Integrated chip-size antennas for wireless microsystems: Fabrication and design considerations

Abstract

This paper reports on fabrication and design considerations of an integrated folded shorted-patch chip-size antenna for applications in shortrange wireless microsystems and operating inside the 5-6 GHz ISM band. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and consists of two adhesively bonded glass wafers with patterned metallization and through-wafer electrical interconnects. Via formation in glass substrates is identified as the key fabrication step. Various options for via formation are compared and from these, a 193 nm excimer laser ablation is selected for fabrication of the antenna demonstrator. The fabricated antenna has dimensions of 4 mm × 4 mm × 1 mm, measured operating frequency of 5.05 GHz with a bandwidth of ∼200 MHz at the return loss of −10 dB and a simulated radiation efficiency of 60% were achieved.

CO2-laser drilling of TGVs for glass interposer applications

“…Due to the high variety of wavelengths, energy and beam sizes, multiple setups are realized in labbased environments or commercially available. Glass via drilling using an Excimer laser can be done by a sequential process or by using a mask for parallel drilling [6,7,8,9,10,11,12]. Tapered vias with diameters smaller 100 µm have been realized as shown in Figure 3.…”

Micromachined High Gain Wideband Antennas for Wireless Communications

“…Mendes et al have reported an onchip integrated, folded short-patch antenna (Mendes et al, 2006). It consists of three horizontal metal sheets that are electrically connected by two vertical metal walls.…”

RF microsystems for wireless sensors networks

“…The investigation of new frequency bands [1] and new geometries [2] will make possible to have smaller antennas to integrate in wireless microsystems [3,4]. This makes the chose of the most suitable frequency, one of the more decisive aspects in the design of RF transceivers.…”