2017
DOI: 10.1109/tcpmt.2017.2704525
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Integrated Circuit Cooling Using Heterogeneous Micropin-Fin Arrays for Nonuniform Power Maps

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Cited by 38 publications
(3 citation statements)
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“…As a result, an additional viscous loss associated with the secondary roughness may be introduced. To date, most superfast wicking phenomena have been realized on hierarchical structures of metallic substrates composing of micrometer-scale primary structures and nanoscale secondary roughness. , Recently, the development of advanced silicon-based thermal management technology has brought forward greater requirement of optimized wicking structures for silicon substrates. , In this study, nanopores rather than nanowires are tested as the second level of roughness to the microstructured surface of silicon. We expect that nanopores, as opposed to nanowires, will not narrow the liquid channels so that a droplet may not experience the significant viscous loss associated with the additional roughness.…”
Section: Introductionmentioning
confidence: 99%
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“…As a result, an additional viscous loss associated with the secondary roughness may be introduced. To date, most superfast wicking phenomena have been realized on hierarchical structures of metallic substrates composing of micrometer-scale primary structures and nanoscale secondary roughness. , Recently, the development of advanced silicon-based thermal management technology has brought forward greater requirement of optimized wicking structures for silicon substrates. , In this study, nanopores rather than nanowires are tested as the second level of roughness to the microstructured surface of silicon. We expect that nanopores, as opposed to nanowires, will not narrow the liquid channels so that a droplet may not experience the significant viscous loss associated with the additional roughness.…”
Section: Introductionmentioning
confidence: 99%
“…2,16−18 Recently, the development of advanced silicon-based thermal management technology has brought forward greater requirement of optimized wicking structures for silicon substrates. 19,20 In this study, nanopores rather than nanowires are tested as the second level of roughness to the microstructured surface of silicon. We expect that nanopores, as opposed to nanowires, will not narrow the liquid channels so that a droplet may not experience the significant viscous loss associated with the additional roughness.…”
Section: ■ Introductionmentioning
confidence: 99%
“…Researchers firstly designed the heat sinks with a fixed special structure to enhance the targeted cooling of the predicted hotspots according to the initial transistors' integration on the chip. [21][22][23] For example, the micro heat sink with variable pin fin clustering is designed for the targeted cooling of the predicted hotspots. 21 Similarly, other works have also been done to remove the uneven heat flux generation by varying the fin density in the microchannel heat sinks.…”
Section: Introductionmentioning
confidence: 99%