2004
DOI: 10.1117/12.536469
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Integrated electrical and SEM-based defect characterization for rapid yield ramp

Abstract: Challenges of the new nanometer processes have complicated the yield enhancement process. The systematic yield loss component is increasing, due to the complexity and density of the new processes and the designs that are developed for them. High product yields can now only be achieved when process failure rates are on the order of a few parts per billion structures. Traditional yield ramping techniques cannot ramp yields to these levels and new methods are required.This paper presents a new systematic approach… Show more

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