Integrated Multidisciplinary Design and Optimization Methodologies in Electronics Packaging: State-of-the-Art Review

Abstract

Electronic packaging design is a process that requires optimized solutions based on multidisciplinary design tradeoffs, which usually have complicated relations among multiple design variables. Required numerical analyses such as thermal and thermo-mechanical have hampered this multidisciplinary optimization process because of their time intensive modeling and computation time. This paper presents a state-of-the-art overview of recent multidisciplinary design and optimization methodologies in electronics packaging. The reported methodologies are divided into tow groups: (1) integrated multidisciplinary CAD environment, and (2) automated design and optimization techniques. A semi-automated design environment, which includes graphical user interface, modeling, and simulation, enhances the design procedure in the first group. Fully automated design optimization methodologies are used for various design applications in the second group. In recent years, methodologies using (1) detailed numerical analysis models directly connected to optimization algorithms, (2) design of experiments (DoE), and (3) artificial neural networks (ANNs) have been proposed as new trends in this field. Advantages as well as disadvantages of these methods are discussed.

Multi-Objective optimization entailing computer architecture and thermal design for non-uniformly powered microprocessors

“…The method leverages the phasic behavior in power consumption of programs, and captures as many power phases as possible to form a linear system equation such that functional unit power can be solved. Hamid [6] presented a multidisciplinary design and optimization methodologies in electronic packaging which includes integrated multidisciplinary CAD environment and automated design and optimization techniques. Skadron [15] in his paper "Temperature aware -GPU design" argues for a runtime approach to cooling, reducing the need for bulky and expensive thermal packages and fans.…”

“…If the package is designed for worst-case power dissipation, they must be designed for the most severe hot spot that could arise, which is prohibitively expensive. To reduce packaging cost without unnecessarily limiting performance, it has been suggested that the package should be designed for the worst typical application [4,5,6]. It is therefore very important to create thermal compact model depends on architecture, power maps and floor plans [4] to solve thermal management problem.…”