1999
DOI: 10.1109/84.809061
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Integrated polysilicon and DRIE bulk silicon micromachining for an electrostatic torsional actuator

Abstract: This paper presents a fabrication process that integrates polysilicon surface micromachining and deep reactive ion etching (DRIE) bulk silicon micromachining. The process takes advantage of the design flexibility of polysilicon surface micromachining and the deep silicon structures possible with DRIE. As a demonstration, a torsional actuator driven by a combdrive moving in the out-of-plane direction, consisting of polysilicon fingers and bulk silicon fingers, has been fabricated. The integrated process allows … Show more

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Cited by 100 publications
(61 citation statements)
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“…There have been many efforts to employ vertical comb actuators fabricated on SOI wafers [2]- [4]. The high force density of a vertical comb drive actuator enables low voltage and large displacement actuation of these high-aspect SOI structures.…”
Section: Ilicon-on-insulatormentioning
confidence: 99%
“…There have been many efforts to employ vertical comb actuators fabricated on SOI wafers [2]- [4]. The high force density of a vertical comb drive actuator enables low voltage and large displacement actuation of these high-aspect SOI structures.…”
Section: Ilicon-on-insulatormentioning
confidence: 99%
“…Propagation through a distance Propagation through a lens (31) Equations (29)-(31) may be used to simulate propagation through an unfolded cross connect. If any mirror surface is spherically curved, its effect may also be modeled by replacing it with an equivalent spherical lens, and using the algorithm once more.…”
Section: Numerical Algorithmmentioning
confidence: 99%
“…This problem may be alleviated by a nonlinear elastic suspension [30]. Alternatively, a comb drive may be used instead of a parallel plate drive [31]- [33].…”
Section: Introductionmentioning
confidence: 99%
“…In one design for torsional actuators Hah and co-workers interleaved vertically aligned comb-finger sets with planarized polysilicon structures [3] using a process employing chemical-mechanical polishing (CMP) to achieve both higher frequencies and larger scan angles than those obtained in earlier designs built with lateral comb-drives. Other vertically aligned comb-drive designs have been fabricated using polysilicon-on-SOI [4] or single-crystal silicon coupled with a wafer-bonding technique [5]. Krisnamurthy and Solgaard demonstrated a self-aligned vertical comb [6] made using wafer-bonding, grinding, and polishing, in addition to an anisotropic-etch step of single-crystal silicon.…”
mentioning
confidence: 99%