Integration and manufacturing aspects of moving from WaferBOND HT-10.10 to ZoneBOND material in temporary wafer bonding and debonding for 3D applications

Jourdain, Anne; Phommahaxay, Alain; Verbinnen, Greet; Murdoch, Gayle; Miller, Andy; Rebibis, Kenneth June; Guerrero, Alice; McCutcheon, Jeremy; Privett, Mark; Neidrich, Jason; Beyer, Gerald; Beyne, Eric

doi:10.1109/ectc.2013.6575559

Cited by 22 publications

(4 citation statements)

References 5 publications

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“…Currently, these temporary bonding materials are mainly classified into thermoplastic and thermosetting bonding adhesives. − However, the poor solubility of thermosetting bonding adhesives limits the application of temporary bonding, and the mechanical peel type, solvent-assisted, and thermal slip type thermoplastic bonding adhesives bond at a temperature of 150–300 °C, which easily cause wafer warpage and have a high risk of wafer breakage. The TPI-200 °C temporary bonding adhesive reported in this work can achieve stress-free debonding at room temperature by a UV laser, which has the advantages of a high processing temperature window, high efficiency, energy savings, easy cleaning, etc.…”

Section: Resultsmentioning

confidence: 99%

Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages

Huang

Liu

et al. 2022

ACS Appl. Polym. Mater.

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Temporary bonding and debonding (TBDB) is a key technology in the semiconductor field to enable 2.5D/3D integration of devices. However, the conventional polyimides, which serve as the laser-response material in TBDB, exhibit extremely poor solubility in aprotic polar solvents due to high-temperature imidization, limiting the cleaning process for wafers after debonding. Herein, a feasible method of controlling the curing temperature to enhance the solubility of thermoplastic polyimide (TPI) has been developed. The results proved that the ultimate solubility of TPI cured at 200 °C (TPI-200 °C) could be as high as 28.4 wt %. Besides, TPI-200 °C exhibits excellent heat resistance, outstanding mechanical properties, and ultrahigh absorptivity (99.96%) at a 355 nm UV wavelength. Meanwhile, we demonstrate the feasibility of the as-prepared TPI material for application in the TBDB process, showing excellent efficiency and low cost, and the follow-up elemental analysis of the cleaned wafer surfaces proved that TPI-200 °C can be completely removed after debonding. All these results demonstrate that TPI materials that can be used for TBDB are promising for ultrathin chip packaging and wafer level packaging (WLP) in the field of advanced electronic packaging.

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Section: Resultsmentioning

confidence: 99%

Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages

Huang

Liu

et al. 2022

ACS Appl. Polym. Mater.

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“…More details can be found Figure 9. Further imec's standard thinning module with 20µm ZoneBond ® glue [7] was used to thin the wafers with 5µm Cu pad topography. No voids were observed after bonding of the wafers to a temporary carrier (Figure10).…”

Section: B Tier2 Process Integration Descriptionmentioning

confidence: 99%

Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges

Vos

Cherman

Detalle

et al. 2014

2014 International 3D Systems Integration Conference (3DIC)

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3D stacked IC (SIC) vs. 3D Interposer wafer processing and assembly challenges are discussed in this paper. We report on the key enabling technologies like wafer thinning, thin wafer handling, TSV, micro bumping, package bumping, stacking and packaging. The limited micro bump yield loss in the 3D SIC case is explained by modeling of bonding force distribution. It is also shown that for sequential stacking a NiB cap of the Cu micro bumps is heavily increasing stacking yield.

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“…For certain applications even, such as CMOS Imager Sensors (CIS), high robustness and yield have already been achieved, enabling early transfer of 3D flows into postfab manufacturing environment [7]. However, a number of 2.5D and 3D-specific integration challenges remain [8]. Yield loss and high cost sensitivity of some of the key driver applications is still a concern and prevent a wide adoption of the 3D TSV technology.…”

Section: Introductionmentioning

confidence: 99%

Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits

Civale¹,

Meynen²,

John

et al. 2013

2013 IEEE International 3D Systems Integration Conference (3DIC)

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Dow Corning developed a silicone-based room temperature temporary bonding and mechanical debonding solution to overcome the current limitations of existing materials and processes for next generation of 2.5D & 3D IC packages; The material properties make possible the use of a simple process sequence which includes material spin coating, room temperature bonding and mechanical debonding. Whereas the Dow Corning bi-layer approach has been reported recently [1], this study focuses on bonding and debonding performance obtained with SUSS MicroTec automated bonding and debonding equipment and for adhesive layer thickness in the range of 100 m. The results reported in this study, particularly the good process control and ability to debond with a low force (<30 N) while keeping the overall sequence short and thus cost-effective, make the Dow Corning temporary bonding and debonding approach a versatile solution towards the validation of the TSV technology for a wide range of 2.5D and 3D stacked ICs applications.

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Integration and manufacturing aspects of moving from WaferBOND HT-10.10 to ZoneBOND material in temporary wafer bonding and debonding for 3D applications

Cited by 22 publications

References 5 publications

Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages

Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages

Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges

Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits

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