Interaction effects of slurry chemistry on chemical mechanical planarization of electroplated copper

Miranda, P.A.; Imonigie, J.A.; Moll, Amy

doi:10.1109/wmed.2004.1297359

Cited by 2 publications

(2 citation statements)

References 6 publications

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“…Step 5-Polish Copper: The surface copper is removed using chemical mechanical planarization (CMP). A two-step process is used in order to remove the thick layer of copper and planarize the surface [23]. The TiN is also removed by CMP.…”

Section: Fabrication Process Stepsmentioning

confidence: 99%

Integrating Through-Wafer Interconnects With Active Devices and Circuits

Jozwiak

Southwick

Johnson

et al. 2008

IEEE Trans. Adv. Packag.

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Abstract-Through wafer interconnects (TWIs) enable vertical stacking of integrated circuit chips in a single package. A complete process to fabricate TWIs has been developed and demonstrated using blank test wafers. The next step in integrating this technology into 3-D microelectronic packaging is the demonstration of TWIs on wafers with preexisting microcircuitry. The circuitry must be electrically accessible from the backside of the wafer utilizing the TWIs; the electrical performance of the circuitry must be unchanged as a result of the TWI processing; and the processing must be as cost effective as possible. With these three goals in mind, several options for creating TWIs were considered. This paper explores the various processing options and describes in detail, the final process flow that was selected for testing, the accompanying masks that were designed, the actual processing of the wafers, and the electrical test results.

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Section: Fabrication Process Stepsmentioning

confidence: 99%

Integrating Through-Wafer Interconnects With Active Devices and Circuits

Jozwiak

Southwick

Johnson

et al. 2008

IEEE Trans. Adv. Packag.

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“…In this study, we used ICue5003 for the CMP of copper, which was mixed with 1mol/l nitric acid to adjust to pH=4, and NANOX#200 for the MP of copper. Table 2 shows the polishing conditions [10].…”

Section: Polishingmentioning

confidence: 99%

Fabrication of Microchannel with Thin Cover Layer for an Optical Waveguide MEMS Switch Based on Microfluidics

Ikemoto

Kimura

2007

IEICE Transactions on Electronics

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Takuji IKEMOTO †a) , Nonmember and Yasuo KOKUBUN †b) , Fellow SUMMARY We propose and demonstrate a new fabrication process of a microchannel using the Damascene process. This process aims to integrate photonic circuits with microchannels fabricated in a glass film. The microchannel is fabricated by the removal of the sacrificial layer after a sacrificial layer is formed by the Damascene process and the cover is formed by sputter deposition. A thin cover layer can be formed by the sacrificial method, because the cover layer is supported by the sacrificial layer during film formation. The cover layer is hermetically sealed, since it is formed by radio frequency (RF) sputtering deposition. The thickness is 1 µm and the width ranges from 3.5 to 8 µm. Using the proposed microchannel fabrication method, we prepared a microelectromechanical system (MEMS) optical switch using microfluidics, and we confirmed its functional operation. This optical switch actuates a minute droplet of liquid injected into the microchannel using Maxwell's stresses. Light propagates straight through the waveguide so that the light passes through the microchannel when the droplet is in the microchannel, but the light rays are completely reflected into a crossed waveguide when the droplet is not in the microchannel. Since this fabrication method uses techniques common to those in the formation of copper wiring in an IC chip, it can be used in the microchannel process. key words: optical switch, microelectromechanical system, microchannel, Damascene process, thin cover layer

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Interaction effects of slurry chemistry on chemical mechanical planarization of electroplated copper

Cited by 2 publications

References 6 publications

Integrating Through-Wafer Interconnects With Active Devices and Circuits

Integrating Through-Wafer Interconnects With Active Devices and Circuits

Fabrication of Microchannel with Thin Cover Layer for an Optical Waveguide MEMS Switch Based on Microfluidics

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