Interconnect series impedance determination using a surface ribbon method

Abstract

In this paper we apply the current filament method to surface "ribbons" instead of volume filaments, leading to a substantial reduction in problem size and increase in computational efficiency. The accuracy is excellent when compared to "full Weeks"' calculations, with a factor of almost 100 reduction in CPU time. 0-7803-2411-0/94/$4.00 0 1994 IEEE

The interdigital coplanar waveguide: a new low-impedance micromachinable planar structure

“…The minimum element dimension was 0.1 m, and the capacitances found for the CPW lines agree to with in 4% of the conformal map predictions [8]. Volume filament method (VFM) [9] and surface ribbon method (SRM) [10] programs determined the frequency-dependent resistances and inductances and , respectively. The VFM program split the conductors into filaments with a minimum dimension of 0.1 skin depths, and the filaments grew geometrically at a rate of 1.5 from the conductor corners.…”

Microwave and millimeter-wave high-Q micromachined resonators

“…Subtracting this from the measured S gives a Q of 1117. The TE 21 u 021 occurs at 37.95 GHz with a measured value of Q l of 690 with an S of y7.9 dB. When the loss of 21 Ž .…”

“…For a resonator in a bandpass bandstop configuration with a resistive matched source and load impedance, the loaded quality factor can be obtained from measuring the 3 dB bandwidth of Ž . the S S as shown below: 21 11…”

Proximity templates for modeling of skin and proximity effects on packages and high frequency interconnect

“…The rapid increase in fast solver computation time associated with modeling high frequency effects has focused research efforts on finding methods to either avoid representing currents in conductor interiors [8,9,10,11,12,13], or to generate specialized basis functions which more easily capture the exponential variation of the conductor current [14,15]. In this paper we demonstrate that it is possible to generate numerically a set of basis functions which efficiently represent conductor current variation.…”