Interconnection of a 2D VCSEL array to a receiver array via a fiber image guide

Maj, T.; Kirk, Andrew G.; Plant, David V.; Ahadian, J.; Fonstad, Clifton G.; Lear, K.L.; Tatah, Karim; Robinson, M. S.; Trezza, J. A.

doi:10.1364/oc.1999.pd2

Cited by 4 publications

(4 citation statements)

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“…Superficially, FIG-based optical interconnects are replacements for lens-based systems [30][31][32][33][34][35][36][37][38], but with added advantages such as going round bends and being impervious to dimensional changes and buckling due to localized heating/cooling of the optical transceive board or module (Fig. 1).…”

Section: Introductionmentioning

confidence: 99%

“…In addition, however, at least four kinds of input-output optics have been used for bringing VCSEL light into the FIG and for taking the output light on to the photodetector. These are: linear fiber tapers [30], large (macro-and mini-) lens-based focusing optics [30,32,35,36], microlens-arrays [34] and separate fibers attached to the output facet of the FIG [34]. Like FSOI, FIGbased optical interconnects that depend on large lens assemblies are bulky and may suffer from both high cost and longterm thermal-mechanical instability.…”

Section: Introductionmentioning

confidence: 99%

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Critical parameters for parallel interconnects using VCSEL arrays and fiber image guides

Mukherjee

Hadley²,

Geib³

et al. 2003

SPIE Proceedings

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Several thousand glass optical fibers fused together is routinely used as fiber image guides for medical and other image remoting applications. Fiber image guides also offer possibility for flexible optical interconnect links with potentially thousands of bi-directional parallel channels with data rates as high as 10 Gbps per channel, leading to more than Tera bits per second aggregate data transfer rates. A fair number of fiber image guide based link demonstrations using vertical cavity surface emitting lasers have been reported. However, little is known about designable parameters and optimization paradigms for applications to massively parallel optical interconnects. This paper discusses critical optical parameters that characterize a massively parallel link. Experimental characterizations were carried out to explore some of the fundamental interactions between single-mode 850 nm VCSELs and fiber image guides having different numerical apertures, 0.25, 0.55 and 1.00. Preliminary optical simulation results are given. Finally, potential directions for further experimental and analytical explorations, and for applicability into designable link systems are suggested.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Critical parameters for parallel interconnects using VCSEL arrays and fiber image guides

Mukherjee

Hadley²,

Geib³

et al. 2003

SPIE Proceedings

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“…The fiber array can be folded on a radius equal to the diameter of the bundle ('l-2 mm) without a noticeable change in the transmission properties of the FIG [4]. Finally the cost of FIG bundles are on the order of $lOs of dollars/meter.…”

Section: Introductionmentioning

confidence: 99%

<title>Interfaces to fiber image guide bundles for high-density optical interconnects</title>

Kostuk

Carriere

2000

SPIE Proceedings

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This paper investigates different factors that influence the channel density of signals propagated through fiber imaging guides. These include the uniformity of the optical power transmitted through the guide, the geometrical structure of the guide, the optical crosstalk to adjacent signal channels, and modal noise. A model for the power uniformity and optical cross-talk is provided and is used to evaluate the channel density of different coupling modes.A commercially available fiber image guide is evaluated in the context of these density considerations and is experimentally tested. Modal noise is also experimentally measured for different coupling conditions to the fiberimaging guide. The resultant signal channel based on these criteria was found to have a diameter approximately 3 times the center spacing of the fiber elements in the fiber imaging guide. This density compares favorably with electrical interconnect densities that are projected for tape automated bonding and flip-chip bonding techniques.

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“…In addition, however, at least four kinds of input-output optlcs have been used for bringing VCSEL light into the FIG and for taking the output light on to the photodetector. These are: linear fiber tapers[30], large (macro-and mini-) lens-based focusing optlcs[30,32,35,36], microlewamays[34] and separate fibers attached to the output facet of the FIG[34]. Like FSOI, FIGbased optical interconnects that depend on large lens assemblies are bulky and may suffer frm both high cost and longtern thermal-mechanical instability.…”

mentioning

confidence: 99%

Final Report on LDRD Project: Heterogeneous Integration of Optoelectronic Arrays and Microelectronics

Geib¹,

Serkland²,

Choquette³

et al. 2003

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This report ww prepared as an acwunt of WOlL sponsored by an agency of the United States Government. Neithcr the United States G o v m m t , nor any agency thereof, nor any of their employees, nor any of their contractors. subcontractors, or their employes, make any warranty, express or implied, or mume any legal liability or rrsponsibility for the accuracy, completeness, or usefulness of any information, apparatus, pmdvct, or process disclosed or represent that its use would m t infringe privately owned rights. Reference herein to any specific commercial product, process. or service by trade name, badcmark, mufachuer, or otherwise, does not necessarily constitute or imply its endorsnnent, recommendation, or favoring by the United States Government, any agency thnmf. or any of their contractms or subcontractors. The v i m and opinions expressed herein do not necessarily state or d C a those of tbe United States Government. any agency thereof, or any of their contlilctols.

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Interconnection of a 2D VCSEL array to a receiver array via a fiber image guide

Cited by 4 publications

References 4 publications

Critical parameters for parallel interconnects using VCSEL arrays and fiber image guides

Critical parameters for parallel interconnects using VCSEL arrays and fiber image guides

<title>Interfaces to fiber image guide bundles for high-density optical interconnects</title>

Final Report on LDRD Project: Heterogeneous Integration of Optoelectronic Arrays and Microelectronics

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