2000
DOI: 10.1364/ao.39.000683
|View full text |Cite
|
Sign up to set email alerts
|

Interconnection of a two-dimensional array of vertical-cavity surface-emitting lasers to a receiver array by means of a fiber image guide

Abstract: The implementation of a 10-channel parallel optical interconnect consisting of a two-dimensional array of vertical-cavity surface-emitting lasers, a 1.35-m fiber image guide, and a metal-semiconductor-metal receiver array is described. Transmission rates of 250 Mbits/s per channel are demonstrated with an optical cross talk of less than -27 dB and a loss of -3 dB. Coupling issues associated with image guides are analyzed and discussed.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
18
0

Year Published

2000
2000
2012
2012

Publication Types

Select...
5
2
1

Relationship

0
8

Authors

Journals

citations
Cited by 36 publications
(18 citation statements)
references
References 10 publications
0
18
0
Order By: Relevance
“…If the variation of the coupling loss due to the positional errors of the stacked waveguides is included, the optical loss uniformities will be increased up to 1.9 and 2.2 dB, respectively. Although the optical uniformities of the stacked waveguide arrays are not as good as other methods such as microlenses ( 1.25 dB) [13] and fiber image guiding ( 1 dB) [14], the stacked waveguide arrays have large potential because the optical uniformities can be reduced by the development of stacking process to reduce the positional errors.…”
Section: Resultsmentioning
confidence: 99%
“…If the variation of the coupling loss due to the positional errors of the stacked waveguides is included, the optical loss uniformities will be increased up to 1.9 and 2.2 dB, respectively. Although the optical uniformities of the stacked waveguide arrays are not as good as other methods such as microlenses ( 1.25 dB) [13] and fiber image guiding ( 1 dB) [14], the stacked waveguide arrays have large potential because the optical uniformities can be reduced by the development of stacking process to reduce the positional errors.…”
Section: Resultsmentioning
confidence: 99%
“…Recent reports by both academia and industry have predicted that the electrical interconnect technology will be replaced by optical interconnect technologies for high performance computing in the next decade [1] [5] [10]. Different approaches for signal transmission and distribution have recently been reported, including, polymer waveguides [11]- [12], fiber ribbons [13]- [14], fiber image guides [15]- [16], and free space optical interconnects using lenses and mirror systems [17]- [21].…”
Section: Introductionmentioning
confidence: 99%
“…In these systems, the VCSEL and photodiode arrays are flip-chip bonded to CMOS chips using heterogeneous integration techniques. Although Plant's demonstration used bulk optics to deliver light between ICs, the free space optical path for a viable system design could use either a rigid optical link [4] (useful for chip-tochip links on a board), shown in Figure 2(a), or a flexible fiber imaging guide [5,6] (useful for boardto-board or chip-to-chip links), shown in Figure 2(b).…”
Section: Optical Technologymentioning
confidence: 99%
“…Typical dimensions are 10 µm core diameter and 12 µm outer diameter for the cladding [6]. With an image spot from an individual laser on the order of 30 µm, the light is coupled into a number of neighboring fibers.…”
Section: Optical Technologymentioning
confidence: 99%
See 1 more Smart Citation