Interface microstructure effects in Au thermosonic ball bonding contacts by high reliability wire materials

März, Benjamin; Graff, Andreas; Klengel, Robert; Petzold, Matthias

doi:10.1016/j.microrel.2014.07.102

Cited by 7 publications

(3 citation statements)

References 12 publications

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“…It is found that the problems of poor heat resistance, low recrystallization temperature, easy generation of harmful intermetallic compounds (IMCs) at high temperature and formation of Kirkendall voids during bonding process, and limited performance development, etc., of Au wire have prevented it fitting the miniaturization requirements of electronic products. Nevertheless, the above problems can be solved by doping trace elements in varied proportions into Au to make Au alloy wire [ 25 , 26 ].…”

Section: Au Bonding Wirementioning

confidence: 99%

“…Adding Ca, Y, Be, etc., to high-purity Au can increase its recrystallization temperature, and improve its wire strength and loop stability. Adding rare earth elements can make the grain refinement, increase the size of heat-affected zone (HAZ), and improve its high temperature stability; adding Cu, Pd, Pt, etc., can inhibit the growth of IMCs and improve the bonding reliability [ 26 ]. Humpston et al [ 27 ] developed a fine wire of the composition Au-1wt%Ti with a diameter of 25 μm through alloying, and its strength is three times higher than that of traditional Au wire.…”

Section: Au Bonding Wirementioning

confidence: 99%

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Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

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Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and will not be replaced by other interconnect methods for a long time in the future. Au bonding wire has been a mainstream semiconductor packaging material for many decades due to its unique chemical stability, reliable manufacturing, and operation properties. However, the drastic increasing price of Au bonding wire has motivated the industry to search for alternate bonding materials for use in microelectronic packaging such as Cu and Ag bonding wires. The main benefits of using Cu bonding wire over Au bonding wire are lower material cost, higher electrical and thermal conductivity that enables smaller diameter Cu bonding wire to carry identical current as an Au bonding wire without overheating, and lower reaction rates between Cu and Al that serve to improve the reliability performance in long periods of high temperature storage conditions. However, the high hardness, easy oxidation, and complex bonding process of Cu bonding wire make it not the best alternative for Au bonding wire. Therefore, Ag bonding wire as a new alternative with potential application comes to the packaging market; it has higher thermal conductivity and lower electric resistivity in comparison with Cu bonding wire, which makes it a good candidate for power electronics, and higher elastic modulus and hardness than Au bonding wire, but lower than Cu bonding wire, which makes it easier to bond. This paper begins with a brief introduction about the developing history of bonding wires. Next, manufacturability and reliability of Au, Cu, and Ag bonding wires are introduced. Furthermore, general comparisons on basic performance and applications between the three types of bonding wires are discussed. In the end, developing trends of bonding wire are provided. Hopefully, this review can be regarded as a useful complement to other reviews on wire bonding technology and applications.

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Section: Au Bonding Wirementioning

confidence: 99%

Section: Au Bonding Wirementioning

confidence: 99%

Research Progress on Bonding Wire for Microelectronic Packaging

et al. 2023

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“…High purity Au wires have been used as an interconnection for most device packages [ 12 , 13 ] as Au has high temperature resistance, excellent conductivity, and good oxidation resistance. Presently, gold wire ball welding has become one of the commonly used welding processes in sensor packaging technology [ 14 , 15 ].…”

Section: Introductionmentioning

confidence: 99%

Au Wire Ball Welding and Its Reliability Test for High-Temperature Environment

Wang

Liu

et al. 2022

Micromachines

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The long-term application of sensors in a high-temperature environment needs to address several challenges, such as stability at high temperatures for a long time, better wiring interconnection of sensors, and reliable and steady connection of the sensor and its external equipment. In order to systematically investigate the reliability of thin coatings at high temperatures for a long time, Au and Cr layers were deposited on silicon substrates by magnetron sputtering. Additionally, samples with different electrode thicknesses were annealed at different temperatures for a varied duration to study the effect of electrode thickness, temperature, and duration on the reliability of samples. The results of tensile and probe tests before and after heat treatment revealed that the mechanical strength and electrical properties have changed after annealing. In addition, the bonding interface was analyzed by a cross-sectional electron microscope. The analysis showed that long-term continuous high-temperature exposure would result in thinning of the electrode, formation of pores, recrystallization, and grain growth, all of which can affect the mechanical strength and electrical properties. In addition, it was observed that increasing the thickness of the gold layer will improve reliability, and the test results show that although the thin metal layer sample is in poor condition, it is still usable. The present study provides theoretical support for the application of thin coatings in high temperatures and harsh environments.

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Microelectronic Packaging: Electrical Interconnections

Charles¹,

Sujan²

2016

Reference Module in Materials Science and Materials Engineering

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Interface microstructure effects in Au thermosonic ball bonding contacts by high reliability wire materials

Cited by 7 publications

References 12 publications

Research Progress on Bonding Wire for Microelectronic Packaging

Research Progress on Bonding Wire for Microelectronic Packaging

Au Wire Ball Welding and Its Reliability Test for High-Temperature Environment

Microelectronic Packaging: Electrical Interconnections

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