Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag–Sn, Cu–Sn and Ni–Sn intermetallic compounds

Flandorfer, Hans; Saeed, Usman; Luef, Christoph; Sabbar, A.; Ipser, Herbert

doi:10.1016/j.tca.2007.04.004

Cited by 81 publications

(31 citation statements)

References 14 publications

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“…Equilibrium compositions measured at 415 and 350°C in the Mg-rich area of the Mg-Sn-Ag system are Laurie et al [85], emf and calorimetric measurements methods Kleppa [75], calorimetric measurements method Flandorfer et al [83], calorimetric measurements method fcc bct(Sn)+Ag3Sn hcp+Ag3Sn hcp…”

Section: Experimental Determination Results Of the Mg-sn-ag Systemmentioning

confidence: 99%

“…And the derived activity of Sn in liquid solution in the work of Iwase et al [81] are self-consistent, but are not in agreement with the previous reported results [73,79,80] The activity of Sn in the liquid phase at 600 and 700°C were measured by Kameda et al [82] using the emf measurements method. The enthalpy of formation of solid phases were measured by Flandorfer et al [83] with calorimetric measurements method.…”

Section: Ag-sn Systemmentioning

confidence: 99%

“…15 Calculated enthalpy of formation of compounds of Ag-Sn system at 25°C compared with experimental data [75,83,85] summarized in Table 3. Sums of elemental compositions are always close to 100 wt.% which indicates that Mg loss by evaporation was small.…”

Section: Ag3snmentioning

confidence: 99%

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Thermodynamic and Experimental Study of the Mg-Sn-Ag-In Quaternary System

Wang

Hudon

Kevorkov

et al. 2014

J. Phase Equilib. Diffus.

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Phase equilibria in the Mg-rich region of the Mg-Sn-Ag ternary system were determined by quenching experiments, differential scanning calorimetry, electron probe micro-analysis, and Xray diffraction techniques. No ternary compounds were found in the studied isothermal sections. A critical evaluation of the available experimental data and a thermodynamic optimization of the Mg-Sn-Ag-In quaternary system were carried out using the calculation of phase diagrams method. The modified quasichemical model in the pair approximation was used for the liquid solution, which exhibits a high degree of short-range order. The solid phases were modeled with the compound energy formalism. All available and reliable experimental data were reproduced within experimental error limits. A self-consistent thermodynamic database was constructed for the Mg-Sn-Ag-In quaternary system, which can be used as a guide for Mg-based alloys development.

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Section: Experimental Determination Results Of the Mg-sn-ag Systemmentioning

confidence: 99%

Section: Ag-sn Systemmentioning

confidence: 99%

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Thermodynamic and Experimental Study of the Mg-Sn-Ag-In Quaternary System

Wang

Hudon

Kevorkov

et al. 2014

J. Phase Equilib. Diffus.

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“…The first minor exothermic peak formed at 98°C is thought to arise due to the reaction between the Sn coating and the Cu core. The reaction between Sn and Cu preferentially forms the intermetallic Cu 6 Sn 5 and releases the exothermic enthalpy of formation [7,8]. These peaks were observed at 98°C irrespective of the thickness of Sn coating.…”

Section: Resultsmentioning

confidence: 97%

“…The second major exothermic peak is thought to arise due to continuing Cu 6 Sn 5 formation and Cu 3 Sn formation via the reaction of the formed Cu 6 Sn 5 with the Cu core. The formation of the Cu 3 Sn phase generates more heat than that of Cu 6 Sn 5 [8]. The temperature at which this second peak was observed decreased from 162°C to 149°C with an increase in Sn thickness.…”

Section: Resultsmentioning

confidence: 98%

Transient Liquid Phase Behavior of Sn-Coated Cu Particles and Chip Bonding using Paste Containing the Particles

Hwang

Lee

2017

Archives of Metallurgy and Materials

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Sn-coated Cu particles were prepared as a filler material for transient liquid phase (TLP) bonding. The thickness of Sn coating was controlled by controlling the number of plating cycles. The Sn-coated Cu particles best suited for TLP bonding were fabricated by Sn plating thrice, and the particles showed a pronounced endothermic peak at 232°C. The heating of the particles for just 10 s at 250°C destroyed the initial core-shell structure and encouraged the formation of Cu-Sn intermetallic compounds. Further, die bonding was also successfully performed at 250°C under a slight bonding pressure of around 0.1 MPa using a paste containing the particles. The bonding time of 30 s facilitated the bonding of Sn-coated Cu particles to the Au surface and also increased the probability of network formation between particles.

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Intermetallic Layer Growth Kinetics in Sn‐Ag‐Cu System using Diffusion Multiple and Reflow Techniques

2014

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A diffusion multiple (DM) technique was applied to the Sn-Ag-Cu ternary system with the aim to determine the kinetics of formation of Cu-Sn intermetallic compounds (IMCs) and to predict properties of the interface in the solder joints. The formation and growth of the Cu-Sn intermetallics at the interface between the Cu as a base material and Sn-Ag-(Cu) solder was additionally studied during a standard reflow soldering process. Based on the experimental data, the kinetic rate constants and the respective activation energies of the Cu-Sn IMCs in the temperature range between 150 and 200°C were calculated and compared with experimental data from the literature. In this way, the mechanism of the pure solid-state reaction (DM technique) and liquid phase reaction (reflow soldering) were studied. The limitations of DM techniques for the prediction of the IMCs growth during reflow soldering process are discussed as well.

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Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag–Sn, Cu–Sn and Ni–Sn intermetallic compounds

Cited by 81 publications

References 14 publications

Thermodynamic and Experimental Study of the Mg-Sn-Ag-In Quaternary System

Thermodynamic and Experimental Study of the Mg-Sn-Ag-In Quaternary System

Transient Liquid Phase Behavior of Sn-Coated Cu Particles and Chip Bonding using Paste Containing the Particles

Intermetallic Layer Growth Kinetics in Sn‐Ag‐Cu System using Diffusion Multiple and Reflow Techniques

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