2022 International Conference on IC Design and Technology (ICICDT) 2022
DOI: 10.1109/icicdt56182.2022.9933119
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Interfacial Layer Engineering to Enhance Noise Immunity of FeFETs for IMC Applications

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Cited by 10 publications
(8 citation statements)
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“…However, a higher value of remanent polarization also enabled the possibility of downsizing the thickness of the oxide layer. Therefore, the theoretical limit on the scaling is relaxed for realizing FeFET memory devices [10][11][12][13][14][15][16][17][18][19][20].…”
Section: Introductionmentioning
confidence: 99%
“…However, a higher value of remanent polarization also enabled the possibility of downsizing the thickness of the oxide layer. Therefore, the theoretical limit on the scaling is relaxed for realizing FeFET memory devices [10][11][12][13][14][15][16][17][18][19][20].…”
Section: Introductionmentioning
confidence: 99%
“…The presence of charge traps at the Ferroelectric /interlayer interface and within the Ferroelectric film can lead to asymmetrical conductive response and large deviceto-device variations [20]- [22]. Abundant efforts have been made to minimize the effects of such non-idealities both from the devices and from the circuits perspective [23]- [28].…”
Section: Introductionmentioning
confidence: 99%
“…Among many emerging memory technologies like resistive random access memory (ReRAM) and phase change memory (PCM), ferroelectric field effect transistors (FeFETs) seem to be the most promising ones. The pronunciation of ferroelectricity in a single-layer thin film of hafnium oxide (HfO 2 ), fast switching, high on-current ( I ON ) to off-current ( I OFF ) ratio , excellent linearity in synaptic weight updates, bidirectional operation, and good endurance are the key technological factors that make FeFET superior to other methods. , ,, However, the primary bottleneck in implementing the FeFET-based computing system lies in the intrinsic stochasticity owing to the polycrystalline nature of HfO 2 -based ferroelectric thin film, as well as inherent defect sites that may capture electrons or holes from the channel side (CS) or gate side (GS). Numerous efforts have been made to reduce the impacts of such nonidealities from the device process, and a circuit point of view. ,, Previously, it has been reported how the quality of the interface and the READ -Voltage play a pivotal role in the performance of FeFETs, especially for low-frequency noise response, retention, and endurance. ,,,, In this work, we aim to maximize the reliability and performance of FeFETs by adopting a synergistic approach of READ -voltage optimization and interfacial-layer engineering.…”
Section: Introductionmentioning
confidence: 99%
“… 34 39 , 23 , 25 Previously, it has been reported how the quality of the interface and the READ -Voltage play a pivotal role in the performance of FeFETs, especially for low-frequency noise response, retention, and endurance. 40 , 41 , 25 , 21 , 42 44 In this work, we aim to maximize the reliability and performance of FeFETs by adopting a synergistic approach of READ -voltage optimization and interfacial-layer engineering.…”
Section: Introductionmentioning
confidence: 99%