Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

Li, Jian Feng; Agyakwa, Pearl; Johnson, C.M.

doi:10.1016/j.actamat.2010.10.053

Cited by 358 publications

(132 citation statements)

References 42 publications

Supporting

Mentioning

123

Contrasting

Order By: Relevance

“…The typical description of the metallurgical reaction during this soldering process is Solid-Liquid Interdiffusion (SLID) bonding [7][8] or Transient Liquid Phase (TLP) soldering [9][10]. As reported by references [11][12], the effect of process parameters (such as time, temperature, and pressure) on the microstructure of IMC joints can be significant which requires a further understanding as far as the reliability is concerned.…”

Section: Introductionmentioning

confidence: 99%

Microstructural and mechanical analysis on Cu–Sn intermetallic micro-joints under isothermal condition

Chen

et al. 2015

Intermetallics

View full text Add to dashboard Cite

Citation: MO, L. et al., 2015 Meanwhile, some equiaxial ultra-fine grains accompanied with the Kirkendall voids, were found only in adjacent to the electroplated copper. In addition, a specific type of micropillar with the size ~5μm×5μm×12μm fabricated by focus ion beam (FIB) was used to carry out the mechanical testing by Nano-indentation, which confirmed that this type of joint is mechanically robust, regardless of its porous Cu 3 Sn IMC interconnection.

show abstract

Section: Introductionmentioning

confidence: 99%

Microstructural and mechanical analysis on Cu–Sn intermetallic micro-joints under isothermal condition

Chen

et al. 2015

Intermetallics

View full text Add to dashboard Cite

show abstract

“…Thus, high-temperature joints can be made at low bonding temperature. SLID processes based on Ag/Sn [3], Cu/Sn [4,5], and Au/Sn [6] had been developed. A concern on SLID joints is the intermetallic compound (IMC) region formed when the molten phase is consumed during bonding.…”

Section: Introductionmentioning

confidence: 99%

Low-pressure solid-state bonding technology using fine-grained silver foils for high-temperature electronics

Lee

2017

J Mater Sci

View full text Add to dashboard Cite

A solid-state bonding technique using fine-grained silver (Ag) foils is presented. The Ag foils are manufactured using many runs of cold rolling and subsequent annealing processes to achieve the favorable microstructure. X-ray diffraction and pole figure measurement are performed to examine the crystal structure and grain orientations. Si chips are bonded to bare Cu substrates using the Ag foil as the bonding medium at 300°C in 0.1 torr vacuum assisted by 6.9 MPa static pressure, which is much lower than that used in conventional thermal compression bonding. Cross sections prepared by focus ion beam show clear bonding interfaces with only a few voids smaller than 100 nm. The bonded structures do not crack after cooling down to room temperature, indicating that the ductile Ag layer is able to manage the strain induced by the large coefficient of thermal expansion mismatch between Si and Cu. The average shear strength of as-bonded samples is 29 MPa. High-temperature storage tests are conducted, and slight increase in strength can be observed after 300°C aging. Fracture analyses show that the breakage occurs within the Ag foil rather than on the bonding interface. Transmission electron microscopy and energydispersive spectroscopy (TEM/EDX) are conducted for Ag/Cu interface after 200-h aging, and the result shows that slight diffusion proceeds during the aging. Since Ag has the highest electrical and thermal conductivities among metals, therefore the bonded structures reported in this paper probably represent the best possible design for high-temperature and high-power electronic packaging applications.

show abstract

“…Along with this, Cu atoms also diffused into the inner SAC solder and formed irregular Cu 6 Sn 5 phase. During the process, no other IMC phases (i.e., Cu 3 Sn emerging during the solid state aging) showed in the reflow time-increasing procedure for the formation needing longer incubation time [19]. The scallop morphology of Cu 6 Sn 5 also remained.…”

Section: Interfacial Microstructures After Reflowing For Different Timementioning

confidence: 87%

Effects of Reflow Time on the Interfacial Microstructure and Shear Behavior of the SAC/FeNi-Cu Joint

Chen

Wang

et al. 2016

Metals

View full text Add to dashboard Cite

Abstract:Effects of reflow time on the interfacial microstructure and shear strength of the SAC/FeNi-Cu connections were investigated. It was found that the amount of Cu 6 Sn 5 within the solder did not have a noticeable increase after a long time period of reflowing, indicating that the electro-deposited FeNi layer blocked the Cu atoms effectively into the solder area during a long period under liquid-conditions. The ball shear test results showed that the SAC/FeNi-Cu joint had a comparable strength to the SAC/Cu joint after reflowing, and the strength drop after reflowing for 210 s was less than that of the SAC/Cu joint.

show abstract

Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process

Cited by 358 publications

References 42 publications

Microstructural and mechanical analysis on Cu–Sn intermetallic micro-joints under isothermal condition

Microstructural and mechanical analysis on Cu–Sn intermetallic micro-joints under isothermal condition

Low-pressure solid-state bonding technology using fine-grained silver foils for high-temperature electronics

Effects of Reflow Time on the Interfacial Microstructure and Shear Behavior of the SAC/FeNi-Cu Joint

Contact Info

Product

Resources

About