2016
DOI: 10.1016/j.jallcom.2016.06.207
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Interfacial reactions in the Ni/(Bi 0.25 Sb 0.75 ) 2 Te 3 and Ni/Bi 2 (Te 0.9 Se 0.1 ) 3 couples

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Cited by 26 publications
(12 citation statements)
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“…The two above-mentioned effects are possibly responsible for the formation of Ni:Bi 2 Se 3 (ref. [37][38][39] and FeSe compounds 40,41 as considering the XANES results. The inset of Fig.…”
Section: Resultsmentioning
confidence: 99%
“…The two above-mentioned effects are possibly responsible for the formation of Ni:Bi 2 Se 3 (ref. [37][38][39] and FeSe compounds 40,41 as considering the XANES results. The inset of Fig.…”
Section: Resultsmentioning
confidence: 99%
“…Thermoelectrics and Their Applications -2021" (ISCTA 2021) by a number of authors [6,11,41,45]. In this regard, it is not recommended to use, for example, nickel contacts in thermoelements at temperatures above 500 K. The possibility of the formation of a transition layer of Ni compounds in the contact region and its increase with temperature are confirmed experimentally by the data of Auger spectroscopy of films with a thickness of 400 nm formed on TE material (Fig.…”
Section: Interstate Conference "mentioning
confidence: 99%
“…Different Ni−Te alloys including Ni 3 Te 2 , NiTe, and NiTe 2 have been found at Ni/Bi 2 Te 3 joints in other works. 22 Ma et al 36 reported a change of the interfacial phase from NiTe to NiTe 2 by increasing the sintering temperature in Ni/Bi 2 Te 3 nanocomposites prepared by spark plasma sintering method. Mu et al 37 reported the heat treatment of Te thin films deposited on Ni substrates.…”
Section: Experimental Section and Measurementsmentioning
confidence: 99%
“…The most commonly used barrier layer in Bi 2 Te 3 -based TE devices is Ni metal. Ni has several advantages including good electrical conductivity and thermal conductivity, good wettability to the Sn-based solder, small CTE difference to Bi 2 Te 3 , good blocking effect, and low cost and high efficiency in preparation. As a barrier layer, Ni not only provides a strong interfacial bonding strength with TE legs but also forms Ni/Bi 2 Te 3 joints with low interfacial contact resistance. However, since Ni is prone to reaction with Te at high temperature, the devices become very unstable, which leads to significant performance deterioration and even device failure.…”
Section: Introductionmentioning
confidence: 99%