Interfacial Reactions in the Ni/Sn-xZn/Cu Sandwich Couples

Yen, Yee‐Wen; Lin, Chien-Yu; Lai, Ming‐Zong; Chen, Wan-Ching

doi:10.1007/s11664-015-4220-8

Cited by 5 publications

(2 citation statements)

References 31 publications

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“…No quaternary IMC was found in the isoplethal section of the Ag-Sn-Cu-Au quaternary system. The IMC growth at the Ni or Au side and IMC precipitation in the solder are very sensitive to the Cu concentration and aging time [6][7][8][9][10][11][12][13]. Therefore, the electronic industry must assess their choice of the optimal solder composition and strictly control the Cn concentration to ensure the joints exhibit consistent with its interfacial properties.…”

Section: Resultsmentioning

confidence: 99%

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The Application of Phase Diagram for Interfacial Reactions in Electronic Packaging

Yen¹

2018

RDMS

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The phase diagram investigation is basically scientific study of materials science and engineering. The basic materials knowledge, such as material thermodynamics and kinetic, phase transformation, and solid state diffusion can be used to explain the intermetallic compounds (IMCs) formed at the interface. Meanwhile, the phase diagram information is one of the important tools, as well. The phenomena in the interfacial reaction should be combined with the phase equilibrium information. Therefore, we can have a clear understanding of the interfacial reaction between the atomic diffusion mechanism and the final equilibrium condition. In the electronic packaging process, lead-free solders are Sn-based alloys, and the substrate is likely to be the Ni/Cu structure. During the soldering process, both Cu and Ni are rapidly dissolved into the molten solder, resulting in the concentration changes of Cu or Ni. The Cu concentration at the solder-joint would dramatically change before and after reflowing due to long heat-treatment aging or the solder-joint volume change. Professor Sinn-Wen Chen and Professor C. Robert Kao have report several studies on Cu concentration effect in the solder/ Cu couple and obtained widely response from the industry. The IMC growth at the Ni side and IMC precipitation in the solder are very sensitive to the Cu concentration and aging time. In this talk, we describe the relationship between the interfacial reactions and the corresponding phase diagrams for the above systems. The soldering society would understand the importance of the phase diagram in electronic package.

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Section: Resultsmentioning

confidence: 99%

“…The eutectic temperature is about 139 °C, lower than the Sn-Pb alloys. Au, Cu, Ni has good mechanical and electrical properties [9][10][11][12][13][14][15]. Therefore, they are generally used as electroplating metal materials and the main under bump metallization metal layer materials in flip chip process.…”

Section: Introductionmentioning

confidence: 99%