Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Cu-Mn UBM During Aging

Tseng, Chien-Fu; Wang, Kai-Jheng; Duh, Jenq‐Gong

doi:10.1007/s11664-010-1371-5

Cited by 18 publications

(5 citation statements)

References 22 publications

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“…In previous studies, − many control methods were proposed to suppress IMC growth at solder joints in electronic packaging. Tsao added TiO 2 particles to a lead-free solder alloy and reduced the diffusion coefficient .…”

Section: Results and Discussionmentioning

confidence: 99%

“…Methods for suppressing IMC growth by adding minor elements such as In and Zn , to lead-free solder alloys have been proposed. Methods using various binary substrates such as Cu–Zn , and Cu–Mn for suppressing IMC growth have also been reported. However, it is difficult to uniformly control the composition of the minor particles and elements in a lead-free solder alloy when using methods that add minor particles and elements.…”

Section: Results and Discussionmentioning

confidence: 99%

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Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene

Lee

Yoon

et al. 2016

ACS Appl. Mater. Interfaces

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The immoderate growth of intermetallic compounds (IMCs) formed at the interface of a solder metal and the substrate during soldering can degrade the mechanical properties and reliability of a solder joint in electronic packaging. Therefore, it is critical to control IMC growth at the solder joints between the solder and the substrate. In this study, we investigated the control of interfacial reactions and IMC growth by the layer-by-layer transfer of graphene during the reflow process at the interface between Sn−3.0Ag−0.5Cu (in wt %) lead-free solder and Cu. As the number of graphene layers transferred onto the surface of the Cu substrate increased, the thickness of the total IMC (Cu 6 Sn 5 and Cu 3 Sn) layer decreased. After 10 repetitions of the reflow process for 50 s above 217 °C, the melting temperature of Sn−3.0Ag−0.5Cu, with a peak temperature of 250 °C, the increase in thickness of the total IMC layer at the interface with multiple layers of graphene was decreased by more than 20% compared to that at the interface of bare Cu without graphene. Furthermore, the average diameter of the Cu 6 Sn 5 scallops at the interface with multiple layers of graphene was smaller than that at the interface without graphene. Despite 10 repetitions of the reflow process, the growth of Cu 3 Sn at the interface with multiple layers of graphene was suppressed by more than 20% compared with that at the interface without graphene. The multiple layers of graphene at the interface between the solder metal and the Cu substrate hindered the diffusion of Cu atoms from the Cu substrate and suppressed the reactions between Cu and Sn in the solder. Thus, the multiple layers of graphene transferred at the interface between dissimilar metals can control the interfacial reaction and IMC growth occurring at the joining interface.

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Section: Results and Discussionmentioning

confidence: 99%

Section: Results and Discussionmentioning

confidence: 99%

Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene

Lee

Yoon

et al. 2016

ACS Appl. Mater. Interfaces

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“…Lin et al (2009) found that addition of Mn particles to Sn-1.0Ag-0.5Cu solder could dramatically suppress the undercooling from solidification of Sn, as the primary MnSn 2 IMC might act as heterogeneous nucleation sites for solidification of Sn dendrites; the addition was also able to suppress the undercooling of SAC alloys. Tseng et al (2010) reported that Mn particle diffusion into Cu 3 Sn slowed the diffusion of Cu in the Cu 3 Sn layer, and the Mn-enriched Cu 3 Sn layer may serve as a diffusion barrier to reduce the interfacial reaction rate. Shnawah et al (2012b) found that addition of Mn particles to low-Ag content SAC solder joints effectively improved the thermal cycling reliability without sacrificing drop impact performance.…”

Section: Introductionmentioning

confidence: 99%

Effects of Mn nanoparticle addition on wettability, microstructure and microhardness of low-Ag Sn-0.3Ag-0.7Cu-xMn(np) composite solders

Tang

Luo

et al. 2018

SSMT

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Purpose The purpose of this paper is to investigate of the effects of Mn nanoparticle addition on the wettability, microstructure and microhardness of SAC0307-xMn(np) (SAC: Sn–Ag–Cu; x = 0, 0.02, 0.05, 0.1 and 0.3 Wt.%) composite solders. Design/methodology/approach The SAC0307-xMn(np) composite solders were prepared by mechanically mixing different weight percentages of Mn nanopowders into the SAC0307 solder paste with rosin flux. In this study, the wettability of the solders was studied using contact angle and spread ratio methods. Afterward, the microstructure of the solders was investigated using scanning electron microscopy, energy-dispersive X-ray spectroscopy and X-ray diffractometry. Moreover, the microhardness of the solders was studied. Findings The wetting process of SAC0307-xMn(np) composite solders was found to experience four stages. Adding a small amount of Mn nanoparticles (x = 0.05 Wt.%) could improve the wettability compared to Mn-free solder. Beyond this level, the wettability deteriorated. The addition of Mn nanoparticles significantly refined the size and spacing of Ag3Sn grains in the solder matrix. When 0.1 Wt.% Mn nanoparticles was added, both the average size of the Ag3Sn grains and the spacing between the Ag3Sn grains decreased significantly and approached minimum values. Beyond this amount, the size and spacing between Ag3Sn grains increased slightly but remained smaller than those in the Mn-free solder matrix. The refined Ag3Sn grains increased the microhardness of the Mn-containing composite solders by 6-25 per cent, in good agreement with the prediction of the classic theory of dispersion strengthening. Originality/value The paper demonstrates that Mn nanoparticle addition could improve the SAC0307-xMn(np) solder wettability and reduce the grain size and spacing between Ag3Sn grains. The enhancement of the solder microhardness shows good correlation with the microstructure.

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“…At the same time, this extra layer influences considerably the properties of the multilayer film as a whole [16]. The system is also of practical interest because it forms Heusler type phases.…”

Section: Introductionmentioning

confidence: 99%

Enhanced diffusion caused by surface reactions in thin films of Sn–Cu–Mn

et al. 2014

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Enhanced diffusion caused by surface reactions in thin films of Sn-Cu-Mn.Thin Solid Films, http://dx.doi.org/10.1016/j.tsf. 2013.10.143 Access to the published version may require subscription. N.B. When citing this work, cite the original published paper. ABSTRACTThis paper describes an investigation of low-temperature diffusion in thin films of Sn/Cu, Cu/Mn and Sn/Cu/Mn. The combination of Rutherford backscattering spectroscopy, grazing incidence X-ray diffraction and Auger electron spectroscopy has been used to provide information about the concentration distribution of components and the depth of the various phases and interfaces. The results show that processes that occur on a free surface of thin films can stimulate diffusion of elements in the bulk. It is shown that the element with higher affinity to oxygen tends to move to the surface in order to oxidize and that this oxidation process provides a driving force for further diffusion. Introduction of a third layer to a bilayer system may lead to changes in the surface topography caused by the reactive diffusion between upper layers and it causes the development of fast, 'short-circuit' diffusion paths and so increasec the diffusion of elements from the bottom to the top. Reactive diffusion between Sn and Cu in the top layers leads to significant changes at the surface with features of the size of 10 to 20 nm appearing. These changes provide shortcuts for the diffusion of Mn atoms from the bottom layer to the free surface. As a consequence of these processes, the sequence of layers of different elements in thin-film structures alters diffusion and results in different sample properties.

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Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Cu-Mn UBM During Aging

Cited by 18 publications

References 22 publications

Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene

Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene

Effects of Mn nanoparticle addition on wettability, microstructure and microhardness of low-Ag Sn-0.3Ag-0.7Cu-xMn(np) composite solders

Enhanced diffusion caused by surface reactions in thin films of Sn–Cu–Mn

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