Interfacial reactions on annealing Cu/Al multilayer thin films

Jiang, Hai; Dai, Jiyan; Tong, H. Y.; Ding, B.Z.; Song, Q.; Hu, Z. Q.

doi:10.1063/1.355183

Cited by 80 publications

(33 citation statements)

References 16 publications

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“…The formation of interfacial phases is affected by their energies of formation. According to previous study, 18) the formation energies of Al 4 Cu 9 and Al 2 Cu are 0.83 eV and 0.78 eV, and there is a greater diffusivity of Cu in Al than that of Al in Cu. Thus the first reaction product Al 2 Cu is presumed, and then the next reaction phase is Al 4 Cu 9 .…”

Section: Development Of Interfacial Phasesmentioning

confidence: 99%

Influence of Interfacial Structure Development on the Fracture Mechanism and Bond Strength of Aluminum/Copper Bimetal Plate

2006

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The aim of this article is to study the influence of interfacial structure development at interface on the fracture mechanism and the bond strength of cold roll bonded Al/Cu bimetal plate. The Al/Cu bimetal plates are produced by cold roll bonding and then sintered at different conditions. The bond strength of the Al/Cu bimetal plate increases generally to maximum values and then decreases to low values with increasing sintering temperature and time. Interfacial structures develop with increasing sintering temperature and time. The main interfacial layers are Al 2 Cu, AlCu, Al 3 Cu 4 and Al 4 Cu 9 . The formation and thickening of those intermetallic compounds promotes cracks propagation and weakens the bond strength of the bimetal plates. The fracture mechanism transforms from ductile to brittle cleavage with the development of interfacial structures. While the bond strength of the material starts to decrease, no obvious Kirkendall effect of void formation is observed in the present study.

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Section: Development Of Interfacial Phasesmentioning

confidence: 99%

Influence of Interfacial Structure Development on the Fracture Mechanism and Bond Strength of Aluminum/Copper Bimetal Plate

2006

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“…The formation of the interfacial phases is affected by their formation energies. According to a previous study, 18) the formation energies of Al 4 Cu 9 and Al 2 Cu are 0.83 eV and Figure 8 shows hardness value (HV) of different intermetallics for Al/Cu bimetal sheet annealed at 500 C for 180 min. Those intermetallics generally possess higher hardness values than those of corresponding base metals of aluminum and copper.…”

Section: Interface Structure Of Al/cu Bimetal Sheetmentioning

confidence: 99%

Effect of Annealing on the Interfacial Structure of Aluminum-Copper Joints

2007

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The aim of this study is to investigate the structure development and growth kinetics of the interfacial structure of cold roll bonded Al/Cu bimetal sheet. An interfacial structure is developed during the annealing process. The characteristics of the constituent phases at the interface of Al/Cu bimetal are studied by means of scanning electron microscope (SEM), X-ray diffraction (XRD) and transmission electron microscope (TEM). The results indicate that an obvious multi-layers interdiffusion structure is developed at the Al/Cu interface. The diffusion layer is consisted of four intermetallic compounds; Al 2 Cu, AlCu, Al 3 Cu 4 and Al 4 Cu 9 . The growth of these intermetallics during annealing can be achieved by the diffusion process. The activation energies of Al 2 Cu, AlCu + Al 3 Cu 4 , Al 4 Cu 9 and the total intermetallic layer are found to be 97.504, 107.46, 117.52 and 107.85 kJ/mol, respectively. These intermetallics generally possess higher hardness values than those of the corresponding base metals. AlCu and Al 3 Cu 4 exhibit much higher hardness than that of Al 2 Cu and Al 4 Cu 9 , which implies lower fracture toughness. The observation of crack propagation paths shows that fracture mainly occurs in the intermetallic compound layers of AlCu and Al 3 Cu 4 , which are located between Al 2 Cu and Al 4 Cu 9 .

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“…Previous studies indicated that Al 2 Cu and Al 4 Cu 9 were the first two IMC phases formed at the Al-Cu interface. [14,15,33] In a study of phase development for the Al-Cu system, Jiang et al [33] reported that the formation energies of Al 2 Cu and Al 4 Cu 9 phases were 0.78 and 0.83 eV, respectively. Because Cu diffuses faster than Al and the solid solubility of Cu in Al is very low (~0.33 at.…”

Section: A Microstructure Evolution During Fswmentioning

confidence: 99%

Effect of Interfacial Microstructure Evolution on Mechanical Properties and Fracture Behavior of Friction Stir-Welded Al-Cu Joints

Xue

Xiao

2015

Metall Mater Trans A

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The interfacial microstructure evolution of Al-Cu joints during friction stir welding and postwelding annealing and its influence on the tensile strength and the fracture behavior were investigated in detail. An obvious interface including three sub-layers of a-Al, Al 2 Cu, and Al 4 Cu 9 intermetallic compound (IMC) layers is generated in the as-FSW joint. With the development of annealing process, the a-Al layer disappeared and a new IMC layer of AlCu formed between initial two IMC layers of Al 2 Cu and Al 4 Cu 9 . The growth rate of IMC layers was diffusion controlled before the formation of Kirkendall voids, with activation energy of 117 kJ/mol. When the total thickness of IMC layers was less than the critical value of 2.5 lm, the FSW joints fractured at the heat-affected zone of Al side with a high ultimate tensile strength (UTS) of~100 MPa. When the thickness of IMC layers exceeded 2.5 lm, the joints fractured at the interface. For relatively thin IMC layer, the joints exhibited a slightly decreased UTS of 90 MPa and an inter-granular fracture mode with crack propagating mainly between the Al 2 Cu and AlCu IMC layers. However, when the IMC layer was very thick, crack propagated in the whole IMC layers and the fracture exhibited trans-granular mode with a greatly decreased UTS of 50-60 MPa.

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Interfacial reactions on annealing Cu/Al multilayer thin films

Cited by 80 publications

References 16 publications

Influence of Interfacial Structure Development on the Fracture Mechanism and Bond Strength of Aluminum/Copper Bimetal Plate

Influence of Interfacial Structure Development on the Fracture Mechanism and Bond Strength of Aluminum/Copper Bimetal Plate

Effect of Annealing on the Interfacial Structure of Aluminum-Copper Joints

Effect of Interfacial Microstructure Evolution on Mechanical Properties and Fracture Behavior of Friction Stir-Welded Al-Cu Joints

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