Introduction of Sub-2-micron Cu traces to EnCoRe enhanced copper redistribution layers for heterogeneous chip integration

Kawamura, Hiroshi; Aritsuka, Yuuki; Tanaka, Masaya; Kasai, Ryohei; Suyama, Jyunichi; Takeda, Mitsuhiro; Okazaki, Yuji; Iida, Haruo; Kitayama, Daisuke; Sakamoto, Kouji; Takano, Takamasa; Akazawa, Miyuki; Sato, Hiroaki; Yamada, Shouhei; Kuramochi, Satoru

doi:10.23919/icep.2018.8374332

Cited by 4 publications

(1 citation statement)

References 7 publications

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“…The effects of dielectric constant on electrical performance are discussed in detail in Section 3. Shinko iTHOP [2,5] 2.5D organic interposer Polymer 3.9 >5 2/2/10 Semi-additive Amkor SWIFT [6,7] Fan-out (wafer) Polyimide 3-3.6 >15 2/2/10 Semi-additive SEMCO [8] Fan-out (panel) PBO 3.1 >5 2/2/6 Semi-additive Kyocera APX [3,9] 2.5D organic interposer Epoxy 3.1 >8 6/6/15 Semi-additive DNP [10] 2.5D glass interposer Polyimide 3-3.6 >12 2/2/20 Semi-additive Amkor SLIM [11] 2.5D interposer SiO 2 4 >2 2/2/2 Damascene Intel EMIB [1] Si bridge SiO 2 4 >2 2/2/2 Damascene TSMC CoWoS [4] 2.5D Si interposer SiO 2 4 >2 0.5/0.5 Damascene…”

Section: Introductionmentioning

confidence: 99%

A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates

Nimbalkar,

Bhaskar,

Kathaperumal

et al. 2023

Polymers

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The ever-increasing demand for faster computing has led us to an era of heterogeneous integration, where interposers and package substrates have become essential components for further performance scaling. High-bandwidth connections are needed for faster communication between logic and memory dies. There are several limitations to current generation technologies, and dielectric buildup layers are a key part of addressing those issues. Although there are several polymer dielectrics available commercially, there are numerous challenges associated with incorporating them into interposers or package substrates. This article reviewed the properties of polymer dielectric materials currently available, their properties, and the challenges associated with their fabrication, electrical performance, mechanical reliability, and electrical reliability. The current state-of-the-art is discussed, and guidelines are provided for polymer dielectrics for the next-generation interposers.

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