“…Due to its stable and homogeneous amorphous state, high mobility (>10cm 2 /V.s), low preparation temperature, excellent large-size uniformity, the IGZO, as an amorphous oxide semiconductor(AOS), has attracted extensive attention as the TFT channel layer since its first report in 2004 by Hosono's group [1]. However, IGZO TFT still has been confronted with some stability problems, such as the uneven display (Mura) of the panel causing by the shift of threshold voltage under some external factors like bias stress [2]. For example, although the mobility and SS of IGZO TFT prepared by Li et al were up to 11.1 cm 2 /V.s and as low as 0.2 V/dec, respectively, ΔVth reached 12.0 Vat -10 V bias for 1400 s, hindering its application in FPD [3].…”