2018
DOI: 10.1088/1742-6596/945/1/012023
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Investigation of MIS-sensor sensitivity to vapor of unsymmetrical dimethylgydrazine in air

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Cited by 2 publications
(2 citation statements)
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“…The use of a metal-glass housing made of a material with high thermal conductivity and a non-optimal heating element design entails high heat losses while maintaining the operating temperature of the sensor, which in turn begins to influence the sensor performance due to its high heat-inertia (the sensor slowly heats up and cools down) in applications where high rapidity, for example, when detecting nitro-containing explosives [9] or high-toxic components of rocket fuel [10]. The improvement of the situation with MIS capacitor-type sensors is seen in the adaptation of laser micromilling technology already used for the manufacture of metal oxide sensors in formfactor of SMD package and described in [11][12][13]. The conversion to a technology there are microheater integrated in a single technological cycle with package will also significantly improve the mechanical stability of the sensor performance, saving sensor design from adhesive joints that are susceptible to destruction during long-term exposure to corrosive gases and high temperatures typical for use in applications for the detection of sub-ppb gas concentrations H2S [14], C2H6S [15] NH3 [16], NO2 [17].…”
Section: Introductionmentioning
confidence: 99%
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“…The use of a metal-glass housing made of a material with high thermal conductivity and a non-optimal heating element design entails high heat losses while maintaining the operating temperature of the sensor, which in turn begins to influence the sensor performance due to its high heat-inertia (the sensor slowly heats up and cools down) in applications where high rapidity, for example, when detecting nitro-containing explosives [9] or high-toxic components of rocket fuel [10]. The improvement of the situation with MIS capacitor-type sensors is seen in the adaptation of laser micromilling technology already used for the manufacture of metal oxide sensors in formfactor of SMD package and described in [11][12][13]. The conversion to a technology there are microheater integrated in a single technological cycle with package will also significantly improve the mechanical stability of the sensor performance, saving sensor design from adhesive joints that are susceptible to destruction during long-term exposure to corrosive gases and high temperatures typical for use in applications for the detection of sub-ppb gas concentrations H2S [14], C2H6S [15] NH3 [16], NO2 [17].…”
Section: Introductionmentioning
confidence: 99%
“…(a) Sketch of MIS gas sensor: 1 -thermistor; 2 -gas sensitive MIS-structure; 3 -film heater; 4 -holder of sensor package; 5 -MIS structure contacts; 6 -heater contacts; (b) Accessories for a standard design of MIS sensors before assembling (holder of TO-8 package, glass insulator, thermistor, chip-resistor heater, gas sensitive MIS structure); (c) MIS gas sensor assembled in TO-8 package, standard design using in work[11][12][13][14][15][16][17] (white substance on photo is adhesive joints).…”
mentioning
confidence: 99%