Investigation of nanoscratch anisotropy of C-plane sapphire wafer using friction force microscope

Nanometric cutting: Mechanisms, practices and future perspectives

“…Based on the same instrument, nanoscratching experiments are widely carried out to imitate the loading condition and material removal process of nanometric cutting nowadays. Combined with post-characterization such as AFM, SEM and cross-sectional transmission electron microscope (TEM), it was usually adopted to study the ductile deformation [84][85][86], BDT phenomenon [83,87,88], cracks formation [9,84,89], and material removal mechanism [90] . Though a lot of nanoscratching tests employed a scratching depth of more than 100 nm or even several micrometres [9,83,85,87,88,90,91], the knowledge of subsurface deformation is still instructive for nanometric cutting.…”

Tribological Properties of Sapphire under Dry Friction against Chromium and Zirconium Ceramics

“…It has been shown experimentally that improved characteristics of diamond wheel grinding can be realized using the proposed technology. In [5], the characteristics and mechanism of scratch formation on the sapphire surface were investigated, namely, the force during scratch formation, the depth and specific energy for each direction of the scratch on the sapphire plane, taking into account the anisotropy of the mechanical properties. As a result, the direction of application of the force was established, in which the specific energy of scratching is minimal.…”