“…In general, CVD [1,2] and Plasma Enhanced Chemical Vapour Deposition (PECVD) techniques [1,3,4] are used to deposit polycrystalline and amorphous silicon films, respectively. High quality films of silicon and of other materials can also be deposited using ion beam deposition technique [1,[4][5][6][7][8]. The grain size of the silicon films from nanocrystalline to polycrystalline is modified by annealing in vacuum or inert gas atmospheres or by surface annealing using lasers.…”