Ion-beam deposition of thin films of ferroelectric lead zirconate titanate (PZT)

Castellano, R. N.; Feinstein, L.G.

doi:10.1063/1.326430

Cited by 183 publications

(27 citation statements)

References 9 publications

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“…They can therefore be used in transducers, surface acoustic wave (SAW) devices, piezoelectric sensors, electro-optical modulators/switches, non-volatile random-access memories (NVRAMs), ferroelectric random-access memories (FRAMs), dynamic randomaccess memories (DRAMs) and ferroelectric fieldeffect transistors (FeFETs) [1][2][3][4][5][6][7][8], among other devices.…”

Section: Introductionmentioning

confidence: 99%

XPS Studies of PZT Films Deposited by Metallic Lead and Ceramic PZT Dual Target Co-Sputtering

Chang

2004

J Electroceram

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The dependence of the chemical states of the constituent elements of a PZT thin film prepared by RF magnetron co-sputtering using ceramic PZT and metallic Pb dual target materials on the Ar + etching time was studied using XPS. The metallic Pb, lead oxide and Pb in PZT led to the different binding energies of the Pb lines. The intensity of binding energy of metallic Pb relative to that of bulk Pb increased with the depth of the film. The peak position and the line shape of the O 1s electron was associated with the different binding energies of oxygen, which interacts with Pb and Ti and Zr atoms to form the metal oxides, and the softening of the O 1s bonds by the bonding interaction in Ti O, Zr O and Pb O. The broad Ti 2 p3/2 line in the PZT film could has been associated with the various charge state of Ti and no spectral changes of Ti 2 p and Zr 3d were observed as the Ar + ion sputtering time was increased.

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Section: Introductionmentioning

confidence: 99%

XPS Studies of PZT Films Deposited by Metallic Lead and Ceramic PZT Dual Target Co-Sputtering

Chang

2004

J Electroceram

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“…The physical methods include ion beam sputtering [15], RF magnetron sputtering [16], DC magnetron sputtering [17], and pulsed laser deposition (PLD) [18]. Laser interference metallurgy is a new method for periodic surface microstructure design on multilayered metallic thin films [19].…”

Section: Metallic Glasses As Materials For Nanoimprintingmentioning

confidence: 99%

Development of Functional Metallic Glassy Materials by FIB and Nanoimprint Technologies

Inoue

Louzguine‐Luzgin

Al-Marzouki

2013

Lecture Notes in Nanoscale Science and Technology

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Patterning techniques are very important in many areas of modern science and technology including applications. Production of micro-and nano-sized periodical structures has been intensively studied in the last years in order to generate one-, two-, and three-dimensional periodical structures in metals, polymers, and ceramics. The process of patterning commonly involves many individual steps before obtaining the desired structure. In general, a pattering method consists of the following elements: formation of a mask or muster, choice of transfer medium or replications of patterns, and choice of resist, which is usually a functional material capable of serving as the resist. Metallic glass is one of the promising materials for such a purpose. Recently, glassy alloys attracted much attention as imprinting materials because they soften on heating similar to polymers, but on subsequent cooling retain high hardness at room temperature and demonstrate good corrosion resistance [1]. It has been reported that a three-dimensional structure with several tens or hundreds of nanometer in characteristic length scale could be prepared using Pt-, Zr-, Au-based glassy alloy ribbon and Zr-based glassy alloy in bulk form [2][3][4][5] or in a thin film form [6]. In the present chapter we discuss usage of metallic glasses for nanoimprinting and other similar processes.

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“…Ferroelectric thin films can be prepared by a number of different deposition methods [5][6][7][8][9][10][11][12]. The sol-gel method is preferred for many applications because it offers both compositional control and reduced-temperature processing of highly uniform, dense, crack-free films.…”

Section: Introductionmentioning

confidence: 99%

The investigation of key processing parameters in fabrication of Pb(Zr x Ti1−x )O3 thick films for MEMS applications

2007

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It has always been a big challenge to deposit dense and crack-free Pb(Zr x Ti 1−x )O 3 (PZT) thick films through Chemical Solution Deposition (CSD). In this study, a sol with higher concentration (≥0.6 M) was spun onto a platinised silicon substrate. The single layer thickness of a dense, crack-free film with several tenths of nanometres up to 350 nm could be obtained. It was found that the key factor in obtaining thick crack-free films was to choose an appropriate heating profile. In this study, the deflection of a single layer at various stages of heating was analysed through the measurement of the wafer curvature using the Dektak profilometer. As a result three characteristic changes of deflection were found, happening at 300, 450 and 500°C. These obvious changes in wafer deflection closely relate to the transformations of sol-to-gel, gel-to-amorphous solid and amorphous solid-to-solid crystals. Furthermore, using these temperatures to thermally treat each single layer, it was possible to obtain thick crack-free films by repeatedly spin coating. The dielectric and piezoelectric properties, such as d 33,f and e 31,f , of the films with different thicknesses and orientations were measured and compared.

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Ion-beam deposition of thin films of ferroelectric lead zirconate titanate (PZT)

Cited by 183 publications

References 9 publications

XPS Studies of PZT Films Deposited by Metallic Lead and Ceramic PZT Dual Target Co-Sputtering

XPS Studies of PZT Films Deposited by Metallic Lead and Ceramic PZT Dual Target Co-Sputtering

Development of Functional Metallic Glassy Materials by FIB and Nanoimprint Technologies

The investigation of key processing parameters in fabrication of Pb(Zr x Ti1−x )O3 thick films for MEMS applications

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