2016
DOI: 10.1007/s00339-016-0308-0
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Ion-bombardment-induced reduction in vacancies and its enhanced effect on conductivity and reflectivity in hafnium nitride films

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Cited by 3 publications
(4 citation statements)
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“…and material properties. Furthermore, the trends in material property variation reported for substrate biasing during conventional flux-controlled deposition processes (PECVD or PVD) are similar to those observed in the surface-controlled PEALD processes of this work for all films 44 , 57 60 except SiN x . Enhancing ion energies during PEALD of SiN x with relatively small ⟨ V bias ⟩ (<−100 V) lowered mass density, refractive index, and compressive stress while simultaneously increasing WER which are opposite to the trends reported for SiN x PECVD or PVD processes with substrate biasing.…”
Section: Discussionsupporting
confidence: 78%
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“…and material properties. Furthermore, the trends in material property variation reported for substrate biasing during conventional flux-controlled deposition processes (PECVD or PVD) are similar to those observed in the surface-controlled PEALD processes of this work for all films 44 , 57 60 except SiN x . Enhancing ion energies during PEALD of SiN x with relatively small ⟨ V bias ⟩ (<−100 V) lowered mass density, refractive index, and compressive stress while simultaneously increasing WER which are opposite to the trends reported for SiN x PECVD or PVD processes with substrate biasing.…”
Section: Discussionsupporting
confidence: 78%
“…and material properties. Furthermore, the trends in material property variation reported for substrate biasing during conventional flux-controlled deposition processes (PECVD or PVD) are similar to those observed in the surface-controlled PEALD processes of this work for all films , except SiN x . Enhancing ion energies during PEALD of SiN x with relatively small ⟨ V bias ⟩ (<−100 V) lowered mass density, refractive index, and compressive stress while simultaneously increasing WER which are opposite to the trends reported for SiN x PECVD or PVD processes with substrate biasing. , Even for substrate biasing during PEALD, the mass density of TiO x as a function of ⟨ V bias ⟩ increased for films in this work but decreased for films deposited in previous work reported by Profijt et al, who used different Ti precursors. , The unique trends in property variation with substrate biasing signify how the effects of controlling ion-surface interactions can be highly material and/or process specific.…”
Section: Discussionsupporting
confidence: 77%
“…In near-stoichiometric films, a significant increase in the electron mean free path leads to higher reflectivity. Negative substrate bias also improves optical reflectivity due to reduced nitrogen and hafnium vacancies in the film. , Similarly, the optical properties of ZrN are also improved by tuning the growth parameters. However, simultaneous tuning of all of the growth parameters to achieve the highest optical reflectivity achievable in HfN and ZrN films remains unexplored. In this work, we demonstrate record-high solar and infrared reflectance of epitaxial stoichiometric HfN and ZrN thin films by optimizing all of the growth parameters.…”
Section: Introductionmentioning
confidence: 99%
“…Negative substrate bias also improves optical reflectivity due to reduced nitrogen and hafnium vacancies in the film. 32,33 Similarly, the optical properties of ZrN are also improved by tuning the growth parameters. 34−36 However, simultaneous tuning of all of the growth parameters to achieve the highest optical reflectivity achievable in HfN and ZrN films remains unexplored.…”
Section: ■ Introductionmentioning
confidence: 99%