2017
DOI: 10.1109/jphotov.2016.2614123
|View full text |Cite
|
Sign up to set email alerts
|

Junction Resistivity of Carrier-Selective Polysilicon on Oxide Junctions and Its Impact on Solar Cell Performance

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4

Citation Types

3
65
0

Year Published

2017
2017
2024
2024

Publication Types

Select...
6

Relationship

2
4

Authors

Journals

citations
Cited by 99 publications
(68 citation statements)
references
References 34 publications
3
65
0
Order By: Relevance
“…Figure shows the ion‐implanted and inkjet‐patterned IBC solar cells with POL y‐Si on O xide (POLO) junctions for both polarities (POLO‐IBC cells) with an active cell area of 7.6 × 15.5 mm, which we prepare following to the cell process described in the studies of Rienäcker et al . The p + POLO emitter and n + POLO base contact are separated by a 100‐μm wide textured trench region and form an interdigitated pattern with a pitch of 952 μm on the rear side of a saw‐damage etched 156 × 156 mm n ‐type Czochralski silicon wafer with a base resistivity of 4 Ωcm and a final thickness of 155 μm.…”
Section: Methodsmentioning
confidence: 99%
See 2 more Smart Citations
“…Figure shows the ion‐implanted and inkjet‐patterned IBC solar cells with POL y‐Si on O xide (POLO) junctions for both polarities (POLO‐IBC cells) with an active cell area of 7.6 × 15.5 mm, which we prepare following to the cell process described in the studies of Rienäcker et al . The p + POLO emitter and n + POLO base contact are separated by a 100‐μm wide textured trench region and form an interdigitated pattern with a pitch of 952 μm on the rear side of a saw‐damage etched 156 × 156 mm n ‐type Czochralski silicon wafer with a base resistivity of 4 Ωcm and a final thickness of 155 μm.…”
Section: Methodsmentioning
confidence: 99%
“…The p + POLO emitter and n + POLO base contact are separated by a 100‐μm wide textured trench region and form an interdigitated pattern with a pitch of 952 μm on the rear side of a saw‐damage etched 156 × 156 mm n ‐type Czochralski silicon wafer with a base resistivity of 4 Ωcm and a final thickness of 155 μm. The applied p + POLO and n + POLO junctions exhibit low contact resistivity of around 1 mΩcm 2 , while featuring excellent passivation qualities, resulting in a saturation current density J 0 of 4 and 2 fA/cm 2 per side, respectively …”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…Considering these achievements, integrating passivating contacts in a back-contacted architecture is the obvious c-Si single-junction solar-cell design towards highest conversion efficiencies. Such an approach has increasingly been researched in both academia and industry over the past decade [14][15][16][17][18][19][20][21] , resulting in the past few years in several record devices with efficiencies ≥25% (refs 22-26). Technologically, it is of note that all these outstanding results have been reached with passivating contacts that are either silicon-oxide-based 22 or fabricated by low-temperature depositions of hydrogenated silicon thin films [24][25][26] , distinctive of the so-called silicon heterojunction (SHJ) technology (ref.…”
mentioning
confidence: 99%
“…We vary the front surface recombination velocity and the surface recombination velocity at the interface of the c‐Si to the unimplanted region from 0.1 to 100 cm s −1 . We use the contact resistivity values measured in Rienacker et al The generation profile is simulated by Sunrays with the measured layer thicknesses as input parameter. The optical properties of poly‐Si are taken from Reiter et al Table lists the input parameters for the three analyzed solar cells.…”
Section: Methodsmentioning
confidence: 99%