Kapitza Resistance

Pollack, Gerald L.

doi:10.1103/revmodphys.41.48

Cited by 549 publications

(276 citation statements)

References 52 publications

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“…However, graphene properties are only partially reflected in nanocomposites 10 , where thermal transport is not limited by the thermal conduction of graphene itself but rather by the high thermal resistance at the contact between nanoplatelets [11][12][13] . In fact, the reach of a percolation threshold, a value over which the particles inside a composite material get physically in contact, is not enough to improve radically the overall thermal conductivity 14 .…”

Section: Introductionmentioning

confidence: 99%

Molecular junctions for thermal transport between graphene nanoribbons: Covalent bonding vs. interdigitated chains

Pierro

Saracco

Fina

2018

Computational Materials Science

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Proper design and manufacturing thermal bridges based on molecular junctions at the contact between graphene platelets or other thermally conductive nanoparticles would provide a fascinating way to produce efficient heat transport networks for the exploitation in heat management applications. In this work, using Non Equilibrium Molecular Dynamics, we calculated thermal conductance of alkyl chains used as molecular junctions between two graphene nanoribbons, both as covalently bound and Van der Waals interdigitated chains. Effect of chain length, grafting density, temperature and chain interdigitation were systematically studied. A clear reduction of conductivity was found with increasing chain length and decreasing grafting density, while lower conductivity was observed for Van der Waals interdigitated chains compared to covalently bound ones. The importance of molecular junctions in enhancing thermal conductance at graphene nanoribbons contacts was further evidenced by calculating the conductance equivalence between a single chain and an overlapping of un-functionalized graphene sheets. As an example, one single pentyl covalently bound chain was found to have a conductance equivalent to the overlapping of an area corresponding to about 152 carbon atoms. These results contribute to the understanding of thermal phenomena occurring within networks of thermally conductive nanoparticles, including graphene nanopapers and graphene-based polymer nanocomposites, which are or high interest for the heat management application in electronics and generally in low-temperature heat exchange and recovery.

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Section: Introductionmentioning

confidence: 99%

Molecular junctions for thermal transport between graphene nanoribbons: Covalent bonding vs. interdigitated chains

Pierro

Saracco

Fina

2018

Computational Materials Science

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“…Thermal transport through a GB produces a discontinuity of the temperature due to the interfacial thermal resistance (ITR), which is induced by the differences in composition, structure, and energy carrier at the boundary. This resulting temperature jump 4 (∆T) can be expressed as follows:…”

Section: Introductionmentioning

confidence: 99%

Atomic density effects on temperature characteristics and thermal transport at grain boundaries through a proper bin size selection

Barışık

Kim

2016

The Journal of Chemical Physics

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This study focuses on the proper characterization of temperature profiles across grain boundaries (GBs) in order to calculate the correct interfacial thermal resistance (ITR) and reveal the influence of GB geometries onto thermal transport. The solid-solid interfaces resulting from the orientation difference between the (001), (011), and (111) copper surfaces were investigated. Temperature discontinuities were observed at the boundary of grains due to the phonon mismatch, phonon backscattering, and atomic forces between dissimilar structures at the GBs. We observed that the temperature decreases gradually in the GB area rather than a sharp drop at the interface. As a result, three distinct temperature gradients developed at the GB which were different than the one observed in the bulk solid. This behavior extends a couple molecular diameters into both sides of the interface where we defined a thickness at GB based on the measured temperature profiles for characterization. Results showed dependence on the selection of the bin size used to average the temperature data from the molecular dynamics system. The bin size on the order of the crystal layer spacing was found to present an accurate temperature profile through the GB. We further calculated the GB thickness of various cases by using potential energy (PE) distributions which showed agreement with direct measurements from the temperature profile and validated the proper binning. The variation of grain crystal orientation developed different molecular densities which were characterized by the average atomic surface density (ASD) definition. Our results revealed that the ASD is the primary factor affecting the structural disorders and heat transfer at the solid-solid interfaces. Using a system in which the planes are highly close-packed can enhance the probability of interactions and the degree of overlap between vibrational density of states (VDOS) of atoms forming at interfaces, leading to a reduced ITR. Thus, an accurate understanding of thermal characteristics at the GB can be formulated by selecting a proper bin size. Published by AIP Publishing. [http://dx

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“…6,7 An interface between dissimilar materials, even without defects on the contact surfaces, creates an impedance to thermal transport that depends upon the differences in the densities and phonon propagation speeds for the two materials. The impedance induces an interfacial thermal (or Kapitza) resistance [8][9][10][11] R k ¼ DT/q, where DT denotes the temperature drop across the interface and q the net heat flux flowing across the contact area.…”

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confidence: 99%

Heat conduction across a solid-solid interface: Understanding nanoscale interfacial effects on thermal resistance

Balasubramanian

Puri

2011

Applied Physics Letters

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Phonons scatter and travel ballistically in systems smaller than the phonon mean free path. At larger lengths, the transport is instead predominantly diffusive. We employ molecular dynamics simulations to describe the length dependence of the thermal conductivity. The simulations show that the interfacial thermal resistance Rk for a Si-Ge superlattice is inversely proportional to its length, but reaches a constant value as the system dimension becomes larger than the phonon mean free path. This nanoscale effect is incorporated into an accurate continuum model by treating the interface as a distinct material with an effective thermal resistance equal to Rk.

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Kapitza Resistance

Cited by 549 publications

References 52 publications

Molecular junctions for thermal transport between graphene nanoribbons: Covalent bonding vs. interdigitated chains

Molecular junctions for thermal transport between graphene nanoribbons: Covalent bonding vs. interdigitated chains

Atomic density effects on temperature characteristics and thermal transport at grain boundaries through a proper bin size selection

Heat conduction across a solid-solid interface: Understanding nanoscale interfacial effects on thermal resistance

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