2012
DOI: 10.1103/physrevb.85.113302
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Kinetics ofa-Si:H bulk defect anda-Si:H/c-Si interface-state reduction

Abstract: Low-temperature annealing of hydrogenated amorphous silicon (a-Si:H) is investigated. An identical energy barrier is found for the reduction of deep defects in the bulk of a-Si:H films and at the interface such layers form with crystalline Si (c-Si) surfaces. This finding gives direct physical evidence that the defects determining a-Si:H/c-Si interface recombination are silicon dangling bonds and that also kinetically this interface has no unique features compared to the a-Si:H bulk.

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Cited by 70 publications
(37 citation statements)
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“…14 De Wolf et al obtained similar results in the past, 33 although with shorter τ eff , for deposition temperatures <200…”
Section: Resultssupporting
confidence: 70%
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“…14 De Wolf et al obtained similar results in the past, 33 although with shorter τ eff , for deposition temperatures <200…”
Section: Resultssupporting
confidence: 70%
“…with reduced nano-sized void formation during the initial stage of the growth, are beneficial from an electronic passivation perspective. 33 At the same time the high hydrogen content is reducing the defect density in the layers and the stacks approach a similar τ eff after post-deposition annealing.…”
Section: Resultsmentioning
confidence: 99%
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“…2 In recent years, a-Si:H layers also garnered significant attention, thanks to their excellent crystalline silicon (c-Si) surface passivation properties, even when only a few nm thin. [3][4][5][6][7][8] This property is exploited with remarkable success for passivating-contact fabrication in silicon heterojunction (SHJ) solar cells, [9][10][11][12][13][14][15][16][17][18][19][20][21][22] with reported conversion cell efficiencies as high as 26.3%. 23 For any solar cell technology, an important criterion for ultimate device performance is its stability under prolonged light exposure.…”
mentioning
confidence: 99%
“…15,16 The dangling bonds may be created from plasma luminescence (visible or UV) or electron or particle bombardment (neutrals and ions from the gas phase, the sputtering target and their compounds). 6 In our experiments, the TCO deposition time strongly influences the induced damage, as shown in Fig.…”
mentioning
confidence: 99%