This Mini Review attempts to establish
a roadmap for two-dimensional
(2D) material-based microelectronic technologies for future/disruptive
applications with a vision for the semiconductor industry to enable
a universal technology platform for heterogeneous integration. The
heterogeneous integration would involve integrating orthogonal capabilities,
such as different forms of computing (classical, neuromorphic, and
quantum), all forms of sensing, digital and analog memories, energy
harvesting, and so forth, all in a single chip using a universal technology
platform. We have reviewed the state-of-the-art 2D materials such
as graphene, transition metal dichalcogenides, phosphorene and hexagonal
boron nitride, and so forth, and how they offer unique possibilities
for a range of futuristic/disruptive applications. Besides, we have
discussed the technological and fundamental challenges in enabling
such a universal technology platform, where the world stands today,
and what gaps are required to be filled.