2007
DOI: 10.1016/j.jcrysgro.2006.11.327
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Large-grained polycrystalline silicon films on glass by argon-assisted ECRCVD epitaxial thickening of seed layers

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Cited by 13 publications
(3 citation statements)
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“…This is favorable for the subsequent growth of BaSi 2 layers, because a-axis-oriented BaSi 2 films can be epitaxially grown on Si(111) with a lattice mismatch of approximately 1% [11][12][13][14][15]. However, the growth of (1 0 0)-oriented Si layers has been also reported [16][17][18].…”
Section: Introductionmentioning
confidence: 99%
“…This is favorable for the subsequent growth of BaSi 2 layers, because a-axis-oriented BaSi 2 films can be epitaxially grown on Si(111) with a lattice mismatch of approximately 1% [11][12][13][14][15]. However, the growth of (1 0 0)-oriented Si layers has been also reported [16][17][18].…”
Section: Introductionmentioning
confidence: 99%
“…However, performance has remained poor with best V oc values of $420 mV and efficiencies of $2% in small area cells with $2 mm thick absorber layers. 13 Plasma deposition techniques such as electron cyclotron resonance CVD (ECRCVD) can also be used to provide low energy ion bombardment of the growth surface to increase adatom surface mobilities and reduce epitaxial growth temperatures to below 600 C. Epitaxial thickening of AIC seed layers by ECRCVD has been reported by several authors including Gall et al 25 and Ekanayake et al 38 The best quality epitaxial layers below 600 C are obtained on (100) oriented Si wafers. Typically, epitaxy breaks down above a thickness of $2.5 mm on (100) Si and at much lower thicknesses for other orientations.…”
Section: Absorber Growth On Seed Layers and Device Resultsmentioning
confidence: 99%
“…The obtained poly-Si is heavily Al-doped, that is p-type, and has a large grain size over 10 m and exhibits a preferential (100) crystallographic orientation, which is favorable for the subsequent epitaxial thickening at low temperatures. 8,9) However, the issue in this method is a series resistance of solar cells because sheet resistance of Al-doped p-layer which has limited the cell efficiency in the previous report. 10) In this study, a novel ALILE process has been proposed for improving the efficiency.…”
mentioning
confidence: 99%