Laser-based sample preparation for electronic package failure analysis

Frazier, Brandon M.; Mathews, Scott A.; Duignan, Michael T.; Skoglund, Lars; Wang, Zhiyong; Dias, Rajen

doi:10.1117/12.470645

Cited by 3 publications

(1 citation statement)

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“…: to remove the remaining plastic on a die passivation). [5] Finally the surface state is not to be considered as a negligible parameter. For instance it is wise to consider: reflection factor, multilayer, diffraction index, roughness, porosity, homogeneous composition, and polarization in order to create a local electrical field in the case of metal ablation or welding for instance [6].…”

Section: Laser Ablation Applied To Electronic Packages Analysismentioning

confidence: 99%

Microelectronics failure analysis using laser ablation of composite materials in system in package

Schwindenhammer¹,

Poirier²,

Descamps³

2006

2006 8th Electronics Packaging Technology Conference

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Fast and accurate decapsulation of Integrated Circuits packages is a key step of successful further observations and defect localization in microelectronics analysis laboratories. In addition to classical techniques, laser technology was introduced to enhance considerably performance in creating precise and local exposure of selective sub layers in complex System in Package (SiP). In this paper, we will demonstrate all the benefits of this technique. The results of this new process were characterized according to laser parameters.

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Section: Laser Ablation Applied To Electronic Packages Analysismentioning

confidence: 99%

Microelectronics failure analysis using laser ablation of composite materials in system in package

Schwindenhammer¹,

Poirier²,

Descamps³

2006

2006 8th Electronics Packaging Technology Conference

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Microstructural Investigation and Serial Section Tomography on ASIC Chips for Assurance Through Reverse Engineering Applications

Maitra,

Chakraborty,

Mukhopadhyay

2023

2023 IEEE Physical Assurance and Inspection of Electronics (PAINE)

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Laser-Based Target Preparation in 3D Integrated Electronic Packages

Martens

Mack

Courtade

et al. 2009

Journal of Electronic Packaging

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The trend toward 3D integration in electronic packaging requires that failure analysis procedures and target preparation methods are adapted from conventional discrete packages to these emerging packaging technologies. This paper addresses the feasibility of laser-based target preparation in 3D integrated devices, especially stacked-die packages. Various laser technologies such as ultrashort-pulse lasers, excimer lasers, and diode-pumped solid-state (DPSS) lasers with different wavelengths and pulse durations were evaluated. In particular, it was found that ultrashort-pulse lasers with pulse durations in the femtosecond range were not suitable for ablation of the molding compound (MC). Picosecond lasers were applicable with certain constraints. It was found that for MCs with high filler content, DPSS lasers with pulse durations in the nanosecond range were the best choice. For the removal of stacked silicon dies, the laser wavelength was the most important factor in artifact-free thinning. Laser cross sections through several silicon dies with remarkably small heat-affected zones were also demonstrated. The distinct removal of the MC, silicon dies, and metal interconnected with a single laser source offers new opportunities for laser-based target preparation in 3D integrated electronic packaging devices.

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Laser-based sample preparation for electronic package failure analysis

Cited by 3 publications

References 0 publications

Microelectronics failure analysis using laser ablation of composite materials in system in package

Microelectronics failure analysis using laser ablation of composite materials in system in package

Microstructural Investigation and Serial Section Tomography on ASIC Chips for Assurance Through Reverse Engineering Applications

Laser-Based Target Preparation in 3D Integrated Electronic Packages

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