Laser-drilling formation of through-glass-via (TGV) on polymer-laminated glass

Sato, Yoichiro; Imajyo, Nobuhiko; Ishikawa, Kenji; Tummala, Rao; Hori, Masaru

doi:10.1007/s10854-019-01354-5

Cited by 15 publications

(12 citation statements)

References 17 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Still, due to the optimization of the laser ablation process, we achieved a feature size that allows the TGVs to be fairly circular. It strikes us as highly likely that using an excimer laser for laser ablation [30,36] or activating the glass with a laser instead of performing laser ablation [34] would further reduce the roughness of the TGVs after etching. More details on modifying glass with laser light can be found in the literature [29].…”

Section: Through Glass Viasmentioning

confidence: 99%

See 1 more Smart Citation

Nanocrystalline diamond-glass platform for the development of three-dimensional micro- and nanodevices

Janssens

Vázquez-Cortés

Giussani

et al. 2019

Diamond and Related Materials

View full text Add to dashboard Cite

Low-cost and robust platforms are key for the development of next-generation 3D micro-and nanodevices. To fabricate such platforms, nanocrystalline diamond (NCD) is a highly appealing material due to its biocompatibility, robustness, and mechanical, electrical, electrochemical, and optical properties, while glass substrates with through vias are ideal interposers for 3D integration due to the excellent properties of glass. However, developing devices that are comprised of NCD films and through glass vias (TGVs) has rarely been attempted due to a lack of effective process strategies. In this work, a low-cost process -free of photolithography and transfer-printing -for fabricating arrays of TGVs that are sealed with suspended portions of an ultra-thin NCD film on one side is presented. These highly transparent structures may serve as a platform for the development of microwells for single-cell culture and analysis, 3D integrated devices such as microelectrodes, and quantum technologies. The process is demonstrated by fabricating TGVs that are sealed with an NCD film of thickness 175 nm and diameter 60 µm. The technology described can be extended by replacing NCD with silicon nitride or silicon carbide, allowing for the development of complex heterogenous structures on the small scale.

show abstract

Section: Through Glass Viasmentioning

confidence: 99%

“…on a focused electrical discharging method [35]. Recent work by Sato et al [36] shows that laser ablation is promising for the fabrication of TGVs in polymer-laminated thin glass substrates. The polymer acts as a support for the thin glass plate [30].…”

Section: Introductionmentioning

confidence: 99%

Nanocrystalline diamond-glass platform for the development of three-dimensional micro- and nanodevices

Janssens

Vázquez-Cortés

Giussani

et al. 2019

Diamond and Related Materials

View full text Add to dashboard Cite

show abstract

“…Cracks were generated by the existence of radial stress (

) and shear stress (

) at the TGV–Cu interface in the preliminary theoretical and FE model investigation [ 12 , 13 , 14 ]. The elastic-plastic yield criterion was used in the analysis.…”

Section: Effect Of Geometric Parameters and Materials On Wafer Reliab...mentioning

confidence: 99%

Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection

Zhao

Chen²,

Qin³

2022

Micromachines

View full text Add to dashboard Cite

Three-dimensional (3D) interconnection technology based on glass through vias (TGVs) has been used to integrate passive devices, and optoelectronic devices due to its superior electrical qualities, outstanding mechanical stability, and lower cost. Nevertheless, the performance and reliability of the device will be impacted by the thermal stress brought on by the mismatch of the coefficient of thermal expansion among multi-material structures and the complicated structure of TGV. This paper focuses on thermal stress evolution in different geometric and material parameters and the development of a controlled method for filling polymers in TGV interconnected structures. In addition, a numerical study based on the finite element (FE) model has been conducted to analyze the stress distribution of the different thicknesses of TGV-Cu. Additionally, a TGV interconnected structure model with a polymer buffer layer is given to solve the crack problem appearing at the edge of RDL. Meanwhile, after practical verification, in comparison to the experimental results, the FE model was shown to be highly effective and accurate for predicting the evolution of stress, and several recommendations were made to alleviate stress-related reliability concerns. An improved manufacturing process flow for the TGV interconnected structure was proposed and verified as feasible to address the RDL crack issue based on the aforementioned research. It provides helpful information for the creation of highly reliable TGV connection structures.

show abstract

“…The laser drilling process is widely used to obtain vias in a built-up film. 96,97) However, there are three major difficulties. First, it is difficult to make fine vias and line/space patterns because of laser wavelength limitations.…”

Section: Fine Via Patterning In a Built-up Filmmentioning

confidence: 99%

Rethinking surface reactions in nanoscale dry processes toward atomic precision and beyond: a physics and chemistry perspective

Ishikawa

Ishijima

Shirafuji

et al. 2019

Jpn. J. Appl. Phys.

Self Cite

View full text Add to dashboard Cite

In this review, we discuss the progress of emerging dry processes with atomic precision. Researchers in the field of plasma processing and surface science have addressed the increasingly challenging demands of material selectivity by utilization of synergistic enhancement of etching or deposition. The discussion encompasses major challenges in the plasma science and technology community. The focus of the review is advances in atomic layer etching and area-selective deposition with activation or deactivation, especially in terms of materials scaling and variety. Control of high-aspect-ratio feature fabrication in semiconductor manufacturing and etched shapes of interior features at the nanoscale are needed. Issues related to profile distortion have received much attention. State-of-the-art techniques used in semiconductor manufacturing are reviewed and future challenges are outlined.

show abstract

Laser-drilling formation of through-glass-via (TGV) on polymer-laminated glass

Cited by 15 publications

References 17 publications

Nanocrystalline diamond-glass platform for the development of three-dimensional micro- and nanodevices

Nanocrystalline diamond-glass platform for the development of three-dimensional micro- and nanodevices

Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection

Rethinking surface reactions in nanoscale dry processes toward atomic precision and beyond: a physics and chemistry perspective

Contact Info

Product

Resources

About