Laser-induced shock wave removal of chemical-mechanical polishing slurries from silicon wafers

Lee, J. M.; Cho, S. H.; Park, J. G.; Lee, S. H.; Han, Yonghao; Kim, S. Y.

doi:10.1117/12.486511

Cited by 2 publications

(1 citation statement)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Among various techniques to remove sub-100 nm particles from solid substrates, the laser shock cleaning (LSC) process based on laser-induced breakdown (LIB) of air and plasma formation has attracted substantial attention as the process demonstrated strong potential to remove nanoscale particles from silicon wafers [5][6][7][8]. Recently, removal of polystyrene (PS) particles as small as 10 nm in diameter was reported [8].…”

Section: Introductionmentioning

confidence: 99%

Enhancement of cleaning efficiency by geometrical confinement of plasma expansion in the laser-shock cleaning process for nanoscale contaminant removal

Jang

Lee³

et al. 2009

SPIE Proceedings

View full text Add to dashboard Cite

It has been shown that the laser shock cleaning (LSC) process is effective for removing nanoscale particles from solid surfaces and thus has various potential applications in microelectronic manufacturing. In this work, we propose a simple method to amplify the shock wave intensity generated by laser-induced breakdown (LIB) of air. The suggested scheme employs a plane shock wave reflector which confines the plasma expansion in one direction. As the half of the LIBinduced shock wave is reflected by the reflector, the intensity of the shock wave propagating in the opposite direction is increased significantly. Accordingly, the enhanced shock wave can remove smaller particles from the surface than the existing LSC process. The LSC process under geometrical confinement is analyzed both theoretically and experimentally. Numerical computation of the plasma/shock behavior shows about two times pressure amplification for the plane geometry. Experiments confirm that the shock wave intensity is enlarged by the effect of geometrical confinement of the plasma and shock wave. The result of cleaning tests using polystyrene particles demonstrates that the particle removal efficiency increases by the effect of geometrical confinement.

show abstract