Laser Radar Imager Based on 3D Integration of Geiger-Mode Avalanche Photodiodes with Two SOI Timing Circuit Layers

Aull, Brian F.; Burns, James R.; Chen, Chenson; Felton, Bradley; Hanson, Hugo H.; Keast, C.L.; Knecht, J.M.; Loomis, A.H.; Renzi, Matthew J.; Soares, Anna Elis Paz; Suntharalingam, V.; Warner, K.; Wolfson, Deanna L.; Yost, D.; Young, Douglas

doi:10.1109/isscc.2006.1696163

Cited by 52 publications

(24 citation statements)

References 2 publications

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“…As SPAD array sizes have grown, the on-chip readout bottleneck has also become evident, leading to complex technological solutions [5] and more parallelism on-chip [6]. This trend has enabled the design of massively parallel arrays with the entire photon detection and time-of-arrival (TOA) circuitry being integrated on-pixel [7] [8] [9] [10], and thus enabling real-time FLIM [11].…”

Section: Introductionmentioning

confidence: 99%

Characterization of large-scale non-uniformities in a 20k TDC/SPAD array integrated in a 130nm CMOS process

Veerappan

Richardson²,

Walker

et al. 2011

2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC)

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Abstract-With the emergence of large arrays of highfunctionality pixels, it has become critical to characterize the performance non-uniformity of such arrays. In this paper we characterize a 160x128 array of complex pixels, each with a single-photon avalanche diode (SPAD) and a time-to-digital converter (TDC). A study of the array's non-uniformities in terms of the timing resolution, jitter, and photon responsivity is conducted for the pixels at various illumination levels, temperatures, and other operating conditions. In the study we found that, in photonstarved operation, the TDCs exhibit a median resolution of 55ps and a standard deviation of 2 ps. The pixels show a median timing jitter of 140ps. Moreover, we measured negligible variations in photon responsivity while changing the number of active pixels. These findings suggest that the image sensor can be used in highly reliable, large-scale, time-correlated measurements of single photons for biological, molecular, and medical applications. The chip is especially valuable for time-resolved imaging, single-photon counting, and correlation-spectroscopy under many realistic operating conditions.

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Section: Introductionmentioning

confidence: 99%

Characterization of large-scale non-uniformities in a 20k TDC/SPAD array integrated in a 130nm CMOS process

Veerappan

Richardson²,

Walker

et al. 2011

2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC)

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“…Performance is improved by 1) reducing interconnect resistance, inductance, and capacitance for higher speed, 2) reducing I/O pad count, 3) reducing interconnect power and crosstalk, and 4) reducing the circuit form factor. Several examples of 3D pixel arrays exist [8], [9], [10]. Vertex detectors can take advantage of the 3D work being done in industry.…”

Section: D Integrated Circuitsmentioning

confidence: 99%

3d circuit integration

Yarema¹

2008

Proceedings of the 16th International Workshop on Vertex Detectors — PoS(Vertex 2007)

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High Energy Physics continues to push the technical boundaries for electronics. There is no area where this is truer than for vertex detectors. Lower mass and power along with higher resolution and radiation tolerance are driving forces. New technologies such as SOI CMOS detectors and three dimensional (3D) integrated circuits offer new opportunities to meet these challenges. The fundamentals for SOI CMOS detectors and 3D integrated circuits are discussed. Examples of each approach for physics applications are presented. Cost issues and ways to reduce development costs are discussed.

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“…The advantage of using 3-D is that no area has to be sacrificed on the imaging layer for circuitry (making it a more efficient photon collector), and considerable circuitry can be placed right underneath each pixel for pixel-level processing. For example, this approach has been used to produce a laser radar receiver array [1]. …”

Section: Why 3d?mentioning

confidence: 99%