Laser sintering of silver nanoparticle thin films: microstructure and optical properties

Peng, Panpan; Hu, Anming; Zhou, Yangping

doi:10.1007/s00339-012-6951-1

Cited by 89 publications

(58 citation statements)

References 60 publications

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“…31,32 It is well known that the lattice diffusion occurs at a higher temperature than surface diffusion although there is no clear temperature point to separate two diffusions. Obviously, a higher heating rate will facilitate the lattice and/or grain-boundary diffusion and result in a denser structure.…”

Section: Resultsmentioning

confidence: 99%

Femtosecond laser welded nanostructures and plasmonic devices

Peng

Alarifi

et al. 2012

Journal of Laser Applications

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Nanojoining, a burgeoning research area, becomes a key manufacturing of complicated nanodevices with functional prefabricated components. In this work, various nanojoining methods are first reviewed. For nanojoining of Ag/Au nanoparticles, three methods are investigated comparatively. Thermal annealing shows a two-step solid state diffusion mechanism. Laser annealing by millisecond pulses displays the thermal activated solid state diffusion. Meanwhile, two effects have been identified in femtosecond laser irradiation with different laser intensities: photofragmentation at rather high intensity (∼1014 W/cm2) and nanojoining at low intensity (∼1010 W/cm2). The photofragmentation forms a large number of tiny nanoparticles with an average size of 10 nm. Control over irradiation conditions at intensities near 1010 W/cm2 results in nanojoining of most of the nanoparticles. This nanojoining is obtained through a nonthermal melting and a surface fusion welding. Joined Au nanoparticles are expected to have numerous applications, such as probes for surface enhance Raman spectroscopy.

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Section: Resultsmentioning

confidence: 99%

Femtosecond laser welded nanostructures and plasmonic devices

Peng

Alarifi

et al. 2012

Journal of Laser Applications

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“…First, increasing sintering time leads to grain agglomeration via Ostwald ripening, thereby decreasing the amount of grain boundaries in the structure. Furthermore, the dislocation density decreases with annealing [74]. Finally, decreases in porosity have been observed with increased sintering time, which increases the effective cross-sectional area.…”

Section: Postprint Sintering Of Metal Np Inksmentioning

confidence: 89%

“…Studies to date have leveraged a limited set of characterization methods to correlate printed thin film electrical performance with microstructure [72,74,[87][88][89]. A more comprehensive set of characterization methods shown in Tables 4 and 5 must be employed to establish a better understanding of the kinetics and growth mechanisms during sintering to achieve thin film conductivities near-bulk values for AM-printed metal film lines.…”

Section: Characterization Methods and Figures Of Meritmentioning

confidence: 99%

Printable Materials for the Realization of High Performance RF Components: Challenges and Opportunities

Rosker

Sandhu

Hester

et al. 2018

International Journal of Antennas and Propagation

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Printing methods such as additive manufacturing (AM) and direct writing (DW) for radio frequency (RF) components including antennas, filters, transmission lines, and interconnects have recently garnered much attention due to the ease of use, efficiency, and low-cost benefits of the AM/DW tools readily available. The quality and performance of these printed components often do not align with their simulated counterparts due to losses associated with the base materials, surface roughness, and print resolution. These drawbacks preclude the community from realizing printed low loss RF components comparable to those fabricated with traditional subtractive manufacturing techniques. This review discusses the challenges facing low loss RF components, which has mostly been material limited by the robustness of the metal and the availability of AM-compatible dielectrics. We summarize the effective printing methods, review ink formulation, and the postprint processing steps necessary for targeted RF properties. We then detail the structure-property relationships critical to obtaining enhanced conductivities necessary for printed RF passive components. Finally, we give examples of demonstrations for various types of printed RF components and provide an outlook on future areas of research that will require multidisciplinary teams from chemists to RF system designers to fully realize the potential for printed RF components.

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“…Ag NPs with a ∼2 nm thick PVP coating were prepared following the method reported by Peng et al [14]. (Na 3 C 6 H 5 O 7 ) aqueous solution (12 ml, 200 mM) was added to 200 ml deionized water with vigorous stirring, followed by adding polyvinylpyrrolidone (PVP, 2 ml, 20 mM), [Ag(NH 3 ) 2 ] + (2 ml, 120 mM), and Ag seed (∼5 nm diameter, 0.4 ml, 1 mM) aqueous solution.…”

Section: Experimental and Simulationmentioning

confidence: 99%