2021
DOI: 10.1002/aelm.202100419
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Lateral Growth of MoS2 2D Material Semiconductors Over an Insulator Via Electrodeposition

Abstract: Developing novel techniques for depositing transition metal dichalcogenides is crucial for the industrial adoption of 2D materials in optoelectronics. In this work, the lateral growth of molybdenum disulfide (MoS2) over an insulating surface is demonstrated using electrochemical deposition. By fabricating a new type of microelectrodes, MoS2 2D films grown from TiN electrodes across opposite sides are connected over an insulating substrate, hence, forming a lateral device structure through only one lithography … Show more

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Cited by 10 publications
(4 citation statements)
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“…The rate of growth at the edges is likely to be enhanced by the surface effect of SiO 2 sidewalls and the change from planar diffusion to semispherical diffusion once the 200 nm deep cell is filled with PCM. Surface enhancement in the deposition rate near SiO 2 surfaces has also been reported previously. , The AFM profile presented in Figure d shows that the shape of the sidewalls is angled. The angled shape of the sidewalls is caused by the isotropic wet etching, which was performed subsequent to dry etching in a two-step etching process (Figure S1).…”
Section: Resultssupporting
confidence: 84%
See 1 more Smart Citation
“…The rate of growth at the edges is likely to be enhanced by the surface effect of SiO 2 sidewalls and the change from planar diffusion to semispherical diffusion once the 200 nm deep cell is filled with PCM. Surface enhancement in the deposition rate near SiO 2 surfaces has also been reported previously. , The AFM profile presented in Figure d shows that the shape of the sidewalls is angled. The angled shape of the sidewalls is caused by the isotropic wet etching, which was performed subsequent to dry etching in a two-step etching process (Figure S1).…”
Section: Resultssupporting
confidence: 84%
“…Surface enhancement in the deposition rate near SiO 2 surfaces has also been reported previously. 41,42 The AFM profile presented in Figure 2d shows that the shape of the sidewalls is angled. The angled shape of the sidewalls is caused by the isotropic wet etching, which was performed subsequent to dry etching in a two-step etching process (Figure S1).…”
Section: Resultsmentioning
confidence: 99%
“…Overall, it is clear that the film is composed of well-ordered 2D layers and the layer ordering of a particular layer tends to follow that of previous layers. It was noticed that the horizontal layer ordering changes slightly in some regions where the thickness is higher [52]. Figures 4(c) and (d) show high resolution TEM images taken via bright field for a film grown for 10 s. These films are observed to be composed of 1-2 layers only.…”
Section: Temmentioning
confidence: 96%
“…Fabrication of such atomically thin out-of-plane channel waveguides is not straightforward. However, we expect that as progress with lateral growth, vertical alignment, nanofabrication and anisotropic etching evolves, high quality structures with <30 nm features can be obtained. Small fabrication imperfections while adding to insertion loss are not expected to influence mode dispersion.…”
mentioning
confidence: 99%