2006
DOI: 10.1109/tdmr.2006.876608
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Leakage Current Reduction Techniques in Poly-Si TFTs for Active Matrix Liquid Crystal Displays: A Comprehensive Study

Abstract: This paper critically examines the leakage current reduction techniques for improving the performance of polycrystalline silicon (poly-Si) thin-film transistors (TFTs) used in active matrix liquid crystal displays. This is a first comprehensive study in literature on this topic. The review assesses important proposals to circumvent the leakage current problem in poly-Si TFTs and a short evaluation of strengths and weaknesses specific to each method is presented. Also, a new device structure called the triple-g… Show more

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Cited by 43 publications
(19 citation statements)
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“…Si TFTs often show the high operating voltages [1][2][3], which is due to the fact that the silanol (Si-OH) groups on the surface of silica (SiO2) nanoparticles form hydrogen bonds between these particles [2,4]. These bonds cause an increase in surface roughness as revealed in scanning electron microscopy (SEM) images [5].…”
Section: Introductionmentioning
confidence: 99%
“…Si TFTs often show the high operating voltages [1][2][3], which is due to the fact that the silanol (Si-OH) groups on the surface of silica (SiO2) nanoparticles form hydrogen bonds between these particles [2,4]. These bonds cause an increase in surface roughness as revealed in scanning electron microscopy (SEM) images [5].…”
Section: Introductionmentioning
confidence: 99%
“…It is worth mentioning that the voltage of A node is greatly affected by the light emitting component because of the leakcurrent generated by illumination from the pixel [8]. The storage capacitor Cs will be accordingly discharged/charged in frame 1/frame 2 discussed earlier, leading to poor holding capability.…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, scaling of MOSFET size leads to shrink channel lengths under 50 nm and in order to reach the higher drain current; the high doping concentration or the thin gate oxide has to be utilized. These cause destructive problems such as power consumption because of increment in the direct tunneling gate leakage current and reduce the carrier mobility due to the higher Coulomb scattering rates [1][2][3][4][5][6]. As a consequence, SiGe alloy is employed to enhance device performance by improving carrier mobility in the channel.…”
Section: Introductionmentioning
confidence: 99%