Length-scale-dependent cracking and buckling behaviors of nanostructured Cu/Cr multilayer films on compliant substrates

Wu, Kai; Zhang, J.Y.; Li, J.; Wang, Y.Q.; Liu, G.; Sun, Jun

doi:10.1016/j.actamat.2015.08.055

Cited by 46 publications

(17 citation statements)

References 87 publications

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“…However the improvement in the design of such films can be made by using significantly stiffer film or relatively much compliant substrate, making small, and putting the film system in region IV, where somewhat crack initiation can be reduced. For complaint substrate bonded to multi-layered film, similar behaviour is observed which has been modelled in [94]. …”

Section: Analysis For the Case 'No Pre-exiting Interfacial Crack Exissupporting

confidence: 54%

A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems

Nazir

Khan

2017

Engineering Failure Analysis

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This paper contains a review of the most vital concepts regarding the analysis and design of film systems. Various techniques have been presented to analyse and predict the failure of films for all common types of failure: fracture, delamination, general yield, cathodic blistering, erosive and corrosive wear in both organic and inorganic films. Interfacial fracture or delamination is the loss of bonding strength of film from substrate, and is normally analysed based on the fracture mechanics concepts of bi-material systems. Therefore, keeping the focus of this review on bonding strength, the emphasis will be on the interfacial cracking of films and the corresponding stresses responsible for driving the delamination process. The bi-material characteristics of film systems make the nature of interfacial cracks as mixed mode, with cracks exhibiting various complex patterns such as telephone cord blisters. Such interfacial fracture phenomenon has been widely studied by using fracture mechanics based applicable analysis to model and predict the fracture strength of interface in film systems. The incorporation of interfacial fracture mechanics concepts with the thermodynamics/diffusion concepts further leads to the development of corrosive degradation theories of film systems such as cathodic blistering. This review presents the suggestions for improvements in existing analysis techniques to overcome some of the limitations in film failure modelling. This comprehensive review will help researchers, scientists, and academics to understand, develop and improve the existing models and methods of film-substrate systems.

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Section: Analysis For the Case 'No Pre-exiting Interfacial Crack Exissupporting

confidence: 54%

A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems

Nazir

Khan

2017

Engineering Failure Analysis

View full text Add to dashboard Cite

show abstract

“…Consequently, the emitted dislocations will pile up against the interface along the slip plane, as schematically illustrated in Figure 13. The piled-up dislocation could produce a stress counteracting the applied stress, which is enough for causing the free substrate crack [28,29]. This means that higher applied stress is required to crack the coated sample.…”

Section: Fatigue Behavior and Discussionmentioning

confidence: 99%

Fatigue and Mechanical Behavior of Ti-6Al-4V Alloy with CrN and TiN Coating Deposited by Magnetic Filtered Cathodic Vacuum Arc Process

Zhang

Chen

et al. 2019

Coatings

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Coatings of 3 μm CrN and TiN were prepared by a magnetic filtered cathodic vacuum arc process (MFCVA) on Ti-6Al-4V substrates, respectively. Rotating bending tests and uniaxial tests were conducted for investigating the effect of the thin and uniformly distributed hard CrN and TiN coatings on the fatigue and mechanical properties of Ti-6Al-4V substrate. During both tests, no coating spallation phenomenon was observed, which indicated that the hard coating bound well with the substrate. The fatigue test results showed that the fatigue strength of the coated sample was decreased in both the low- and high-cycling fatigue regimes compared with the uncoated Ti-6Al-4V substrate. Compared with the TiN coating, the CrN coating caused a more significant reduction on the fatigue property of the uncoated Ti-6Al-4V substrate due to its inferior plastic deformation capacity. Furthermore, the tensile test results showed that the coated sample had a relative higher ultimate strength, yield strength, and lower elongation compared with the uncoated Ti-6Al-4V substrate. This may be due to the fact that the hard coating could suppress the initiation of cracks, and so higher stress was needed for crack initiating. During the crack propagation period, the hard coating cracked at a relative higher velocity, which led to cracking of the ductile substrate and elongation reduction.

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“…According to the Cordill's discussion [10], the residual tensile stress, even on the order of 1.0 GPa, played a negligible role in the transverse buckling. In addition, the effect of residual stress on the buckling and cracking behaviors has been discussed in the previous study on Cu/Cr NMFs [17], where it was also suggested that the residual stresses have an insignificant influence on buckling and adhesion measurements.…”

Section: Microstructurementioning

confidence: 96%

“…Nanostructured multilayer films (NMFs) have a large number of potential applications, such as a variety of structural uses and microelectromechanical systems (MEMS), due to the ease of tailoring mechanical properties [11][12][13][14][15][16][17][18] and some novel physical properties such as transport properties [19][20][21]. Nevertheless, evaluation of the interfacial adhesion of NMFs on compliant substrate is still unavailable.…”

Section: Introductionmentioning

confidence: 99%

An Easy Way to Quantify the Adhesion Energy of Nanostructured Cu/X (X = Cr, Ta, Mo, Nb, Zr) Multilayer Films Adherent to Polyimide Substrates

Zhang

Liu

et al. 2016

Acta Metall. Sin. (Engl. Lett.)

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An approach based on film buckling under simple uniaxial tensile testing was utilized in this paper to quantitatively estimate the interfacial energy of the nanostructured multilayer films (NMFs) adherent to flexible substrates. The interfacial energies of polyimide-supported NMFs are determined to be *5.0 J/m 2 for Cu/Cr, *4.1 J/m 2 for Cu/Ta, *2.8 J/m 2 for Cu/Mo, *1.1 J/m 2 for Cu/Nb, and *1.2 J/m 2 for Cu/Zr NMFs. Furthermore, a linear relationship between the adhesion energy and the interfacial shear strength is clearly demonstrated for the Cu-based NMFs, which is highly indicative of the applicability and reliability of the modified models.

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Length-scale-dependent cracking and buckling behaviors of nanostructured Cu/Cr multilayer films on compliant substrates

Cited by 46 publications

References 87 publications

A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems

A review of theoretical analysis techniques for cracking and corrosive degradation of film-substrate systems

Fatigue and Mechanical Behavior of Ti-6Al-4V Alloy with CrN and TiN Coating Deposited by Magnetic Filtered Cathodic Vacuum Arc Process

An Easy Way to Quantify the Adhesion Energy of Nanostructured Cu/X (X = Cr, Ta, Mo, Nb, Zr) Multilayer Films Adherent to Polyimide Substrates

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