2022
DOI: 10.1002/adfm.202211022
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Light‐Mediated Multi‐Level Flexible Copper Iodide Resistive Random Access Memory for Forming‐Free, Ultra‐Low Power Data Storage Application

Abstract: This study demonstrates the efficacy of an emerging p-type copper iodide (CuI) semiconductor in a flexible, low-voltage resistive random-access memory (RRAM), which can be readily integrated with metal-oxide n-type counterparts for complementary circuit systems. Herein, CuI RRAM devices are implemented via a room-temperature solid iodination process, exhibiting a consistent On/Off ratio (≈10 4 ), excellent endurance of more than ≈10 3 cycles, together with a long retention period (> 5 × 10 4 s). Furthermore, a… Show more

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Cited by 20 publications
(8 citation statements)
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“…The results revealed that the ON/OFF ratios of Py-COP-0 and Py-COP-3 were 1.73 × 10 5 and 5.06 × 10 5 , respectively, which suggests that these devices meet the requirements of memristor device applications and can be applied to big data storage. [32] The first SET voltage (V th1 ) of the Py-COP-3-based device was distributed in the range of 0.91-1.34 V, while the second SET voltage (V th2 ) was mainly centralized between 1.69 and 1.89 V (Figure 2e). Compared to the broad V th1 distribution of Py-COP-0, Py-COP-3-based devices were more consistent with V th , suggesting the possibility for the Py-COP-3-based devices to be a candidate for multilevel resistive memory.…”
Section: Resultsmentioning
confidence: 96%
“…The results revealed that the ON/OFF ratios of Py-COP-0 and Py-COP-3 were 1.73 × 10 5 and 5.06 × 10 5 , respectively, which suggests that these devices meet the requirements of memristor device applications and can be applied to big data storage. [32] The first SET voltage (V th1 ) of the Py-COP-3-based device was distributed in the range of 0.91-1.34 V, while the second SET voltage (V th2 ) was mainly centralized between 1.69 and 1.89 V (Figure 2e). Compared to the broad V th1 distribution of Py-COP-0, Py-COP-3-based devices were more consistent with V th , suggesting the possibility for the Py-COP-3-based devices to be a candidate for multilevel resistive memory.…”
Section: Resultsmentioning
confidence: 96%
“…Moreover, the conduction in the HRS can be divided into two segments (Figures S12 and S13, Supporting Information): Ohmic contact (I ∝ V) and Schottky contact (log(I) ∝ V 1/2 ). [30][31][32][33] Initially, the migration of diffused cations (mainly Ag + ) from the Au/Ag is governed by the conduction mechanism of thermionic Schottky emission: lnI ∝ √ q 3 4𝜀𝜋d kT × √ V (I is the current, 𝜖 is the dielectric constant, q is the electrical charge, d is the thickness of the Cs 3 Sb 2 I 9 microplate, and V is the applied voltage). The observed transition from the Schottky behavior to Ohmic behavior indicates that the unfilled trap centers are gradually seized by the charged carriers; therefore, the Schottky barrier is overcome by ion migration and arrangement, leading to a larger current increment with the increased voltage.…”
Section: Resultsmentioning
confidence: 99%
“…At higher I cc , a higher V reset is needed, due to the stronger filament formation compared to the lower I cc . 33 Therefore, at lower I cc , V reset tends to zero, indicating the formation of a weak conducting filament, which required a lower V for dissolution. The multilevel RS memristors are also attractive for low-power electronic applications.…”
Section: Resultsmentioning
confidence: 99%
“…V set shows an insignificant change; however, V reset decreases with decreasing I cc . At higher I cc , a higher V reset is needed, due to the stronger filament formation compared to the lower I cc . Therefore, at lower I cc , V reset tends to zero, indicating the formation of a weak conducting filament, which required a lower V for dissolution.…”
Section: Resultsmentioning
confidence: 99%