Limitations on the use of the mixed-mode delaminating beam test specimen: Effects of the size of the region of K-dominance

Becker, T.L.; McNaney, J. M.; Cannon, R. M.; Ritchie, Robert O.

doi:10.1016/s0167-6636(97)00010-0

Cited by 64 publications

(28 citation statements)

References 26 publications

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“…However, these can not be applied to materials with strong interface due to the limitation of the glue strength. In addition, the stress-concentrated region on an interface, which dominates interface delamination, is affected by the length scale (12), (18) . Then, we developed a method (19) for applying a load to dots, of which three-dimensional scale is small, on a substrate by a modified atomic force microscopy (AFM), and successfully separated a hard tungsten (W) micron-dot from a silicon (Si) substrate.…”

Section: Introductionmentioning

confidence: 99%

Direct Measurement of Interface Strength between Copper Submicron-Dot and Silicon Dioxide Substrate

Hirakata

Kitamura

Yamamoto

2004

JSME Int. J., Ser. A

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We develop an experimental evaluation method of interface strength for ductile submicron-dots on a hard substrate without collapse of the dot. The validity is examined by a copper (Cu) submicron-dot on a silicon dioxide (SiO 2 ) substrate with the rigid-layer of tungsten (W), which restrains the deformation and decreases the influence of complicated stress field due to the contact of tip. The diamond tip is dragged horizontally along the SiO 2 surface and the load is applied to the side edge of the W layer at a constant displacement rate using a modified atomic force microscopy. Both the lateral and the vertical load and displacement are continuously monitored during the test. The lateral load, F l , increases almost in proportion to the lateral displacement, δ l , and the Cu dot with the W layer is clearly separated from the SiO 2 along the interface. The restraint by the W layer works well so that there are little damages in both the delaminated W/Cu dot and the substrate. The delamination lateral load, F lC , is successfully measured.

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Section: Introductionmentioning

confidence: 99%

Direct Measurement of Interface Strength between Copper Submicron-Dot and Silicon Dioxide Substrate

Hirakata

Kitamura

Yamamoto

2004

JSME Int. J., Ser. A

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“…A more serious concern regarding the validity of interface stress intensity solutions has come about recently regarding the size of the region of K-dominance, i.e., the size of the region over which the asymptotic stress intensity solutions accurately give the stresses ahead of a crack [46]. Practical interface samples often introduce new size scales to problems, such as a layer thickness for sandwich specimens, which results in Kdominant regions much smaller as compared to monolithic samples [46]. Often this results in the region of K-dominance being embedded within the plastic zone of the lower strength material, bringing into serious question the validity of any fracture criteria based on the stress intensity in these cases [46].…”

Section: IImentioning

confidence: 99%

“…Practical interface samples often introduce new size scales to problems, such as a layer thickness for sandwich specimens, which results in Kdominant regions much smaller as compared to monolithic samples [46]. Often this results in the region of K-dominance being embedded within the plastic zone of the lower strength material, bringing into serious question the validity of any fracture criteria based on the stress intensity in these cases [46].…”

Section: IImentioning

confidence: 99%

Interfacial and near interfacial crack growth phenomena in metal bonded alumina

Kruzic

2001

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This study examines the mechanisms of interfacial and near interfacial crack propagation associated with the failure of sandwich specimens consisting of 99.5% pure polycrystalline alumina: 1) liquid state bonded with 99.999% pure aluminum layers and 2) partial transient liquid phase (PTLP) bonded using copper/niobium/copper interlayers.For the former system, the aluminum layer thickness was varied from 5 to 100 µm; it was found that the 3-point unnotched bending strength of the aluminum bonded joints increased, and the fracture toughness decreased, with decreasing layer thickness.Strength beams failed by ductile failure in the aluminum while fracture toughness samples failed by brittle fracture in the alumina. Under cyclic loading, crack growth occurred primarily by separating the aluminum from the alumina with evidence of ductile fatigue striations; cracks deviated into the alumina only for thin layered samples at high driving forces. Cyclic fatigue thresholds increased with decreasing layer thickness; however, the change to a brittle fatigue mechanism for thin layered samples at high driving forces was detrimental to the overall fatigue resistance. Under static loading in 2 moist air, interfacial separation was never observed at measurable rates (≥ 10 -9 m/sec); however, for 5 and 35 µm thick layered samples, cracks deviated off the interface and grew, sometimes stably, into the alumina resulting in time dependent failure.For alumina PTLP bonded with copper/niobium/copper interlayers, the mean interfacial fracture toughness was found to decrease from 39 J/m 2 to 21 J/m 2 as temperature was increased from 25 to 1000°C. At room temperature, cyclic fatigue crack propagation occurred at both the niobium/alumina interface and in the alumina, with higher fatigue thresholds resulting from a predominantly near interfacial (alumina) crack path. During both fracture and fatigue failure, residual copper at the interface deformed and remained adhered to both sides of the fracture surface, while separation of the niobium/alumina interface appeared essentially brittle in both cases. The observed behaviors of all samples are examined in terms of modulus mismatch effects, the level of plastic constraint, the relative crack propagation resistance of each observed crack path, the loading conditions, extrinsic toughening from ductile phase and/or alumina grain bridging, and environmental influences.i

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“…Formability and the damage resistance of Zn coating strongly depend on its adhesion to a steel substrate [4,5]. Although many methods have been developed for the assessment of adhesion strength of coatings, such as tearing-off [6,7], peelingoff [8], bending [9,10], indentation [11], scratch test [12,13], and shear [14,15], the application of the methods of tearing-off, peeling-off, bending and shear depends on the strength of glue used to bond the coating [6,16]. Another problem about the measured shear strength is that the stress at the interface is not distributed uniformly [14].…”

Section: Introductionmentioning

confidence: 99%

Evaluation of interface adhesion of hot-dipped zinc coating on TRIP steel with tensile testing and finite element calculation

Song

Hosson

Sloof

et al. 2015

Surface and Contact Mechanics Including Tribology XII

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In this work, a methodology for the determination of the interface adhesion strength of zinc coating on TRIP steel is present. This method consists of a conventional tensile test in combination with finite element calculation. The relation between the average interface crack length and the applied tensile stress is determined on the partially delaminated coating with in-situ tensile test. The delamination process of zinc coating on steel substrate is simulated by using a two-grain finite element model with different interface adhesion strengths. By comparing the experimental observation with the finite element calculations, the interface adhesion strength is estimated. The interface adhesion strength of the zinc coating on transformation induced plasticity (TRIP) steel is found as high as 160 MPa. The influences of microstructural parameters of zinc coating including zinc grain orientation and grain size on the delamination behavior of the zinc coating are also analyzed with the finite element model.

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Limitations on the use of the mixed-mode delaminating beam test specimen: Effects of the size of the region of K-dominance

Cited by 64 publications

References 26 publications

Direct Measurement of Interface Strength between Copper Submicron-Dot and Silicon Dioxide Substrate

Direct Measurement of Interface Strength between Copper Submicron-Dot and Silicon Dioxide Substrate

Interfacial and near interfacial crack growth phenomena in metal bonded alumina

Evaluation of interface adhesion of hot-dipped zinc coating on TRIP steel with tensile testing and finite element calculation

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