Line and via voiding measurements in damascene copper lines using metal illumination

Borden, P.; Li, J.P.; Smith, S. R.; Diebold, Andreas; Chism, Will

doi:10.1109/tsm.2003.815633

Cited by 6 publications

(1 citation statement)

References 4 publications

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“…Most methods are based on detecting a change in the total volume of copper in a patterned structure at different locations across a wafer. Metal Illumination surface acoustic wave spectroscopy, and X-ray fluorescence have been proposed as potential solutions to this problem [34,35,36]. Although several methods seem capable of detecting 1% or less change in copper volume, the biggest issue is the variability in copper volume across a wafer and from wafer to wafer due to linewidth variation and variability in Chemical Mechanical Polishing.…”

Section: Figure 7 Schematic Of the Process And Metrologymentioning

confidence: 99%

Metrology (including Materials Characterization) for Nanoelectronics

Diebold¹

2005

AIP Conference Proceedings

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Section: Figure 7 Schematic Of the Process And Metrologymentioning

confidence: 99%

Metrology (including Materials Characterization) for Nanoelectronics

Diebold¹

2005

AIP Conference Proceedings

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Laptop photothermal reflectance measurement instrument assembled with optical fiber components

Yarai

Nakanishi

2007

Review of Scientific Instruments

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In this article, we propose a laptop photothermal reflectance measurement instrument assembled with optical fiber components. The primary feature of this instrument is that all of the optical routes for the pumping and probing beams, as well as the beam sources using a laser diode, are composed of optical fiber and optical fiber components. With this configuration, the problems related to the technical shortcomings of the conventional instrument can be solved completely. Our proposed instrument is also appropriate for in situ measurement of the thermoproperties of thin film. The dimensions of our instrument's case are 400 mm wide, 250 mm deep, and 60 mm tall, and its weight is approximately 1 kg, containing the power supply for driving the laser diode of the pumping beam and electronics for the detection of photothermal reflectance. These are at least 120 and 150 smaller than the volume and weight of the conventional commercial instrument, respectively. Nevertheless, it is only necessary to prepare a synchronous detection instrument for signal recovery (e.g., lock-in amplifier) with our instrument. To evaluate our instrument's thermoproperty measurement capability, we measured the thermal diffusivity and thermal conductivity of Au thin film. The thermal diffusivity of 1.5-microm-thick Au film measured by our instrument matched previously reported values within a margin of error of a few percent.

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