2003
DOI: 10.1109/ted.2003.814983
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"Linear kink effect" induced by electron valence band tunneling in ultrathin gate oxide bulk and SOI MOSFETs

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Cited by 125 publications
(94 citation statements)
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“…As soon as the gate voltage is higher than the threshold for electron valence band (EVB) tunneling a kink effect is occurring, resulting in an increase of the drain current and the appearance of a second peak in the transconductance curve. This effect has been discussed in detail and the impact of different technological parameters is well understood [15]. After an ionizing irradiation the LKE effect becomes more pronounced so that the height of the second peak increases and shifts to higher frontgate voltages as shown in Fig.…”
Section: Soi Technologiesmentioning
confidence: 93%
“…As soon as the gate voltage is higher than the threshold for electron valence band (EVB) tunneling a kink effect is occurring, resulting in an increase of the drain current and the appearance of a second peak in the transconductance curve. This effect has been discussed in detail and the impact of different technological parameters is well understood [15]. After an ionizing irradiation the LKE effect becomes more pronounced so that the height of the second peak increases and shifts to higher frontgate voltages as shown in Fig.…”
Section: Soi Technologiesmentioning
confidence: 93%
“…These transistors even have augmented currents at various low voltages. Metallic element fabric to be subjected from the transient body impact that successively adds to the History impact [13,14].…”
Section: Fdsoi Devicementioning
confidence: 99%
“…[9,8] the pair is then split apart, using a process that leaves a thin (relative to the thickness of the starting wafer), device-quality layer of single crystal silicon on top of the oxide layer (which has now become the BOX) on the handle wafer. This [10,11,12] is called the "layer transfer" technique, because it transfers a thin layer of device-quality silicon onto an oxide layer that was thermally grown on a handle wafer. The "layer transfer" approach has lead to the development of at least three production methods for fabrication of SOI wafers; Smart cut TM (UNIBOND) SOI wafers, Nanocleave TM SOI wafers, and ELTRANTM SOI wafers.…”
Section: Figure 1 Fabrication Process Of Soi Technologymentioning
confidence: 99%