Low-cost laser printable photomask: One-step, photoresist-free, fully solution processed high-grade photolithography mask

Yun, Jin‐Ho; Kim, Jong-Su; Yang, Minyang; Kang, Bongchul

doi:10.1016/j.apsusc.2016.10.134

Cited by 13 publications

(7 citation statements)

References 24 publications

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“…Even if the pattern resolution of the submicron level has been reported using a femtosecond laser, the pattern resolution of 10 μm reported herein is noteworthy because the fabrication of high-resolution thin microelectrodes on a rough and uneven surface is a challenging task as a first attempt. Previously reported studies have focused on improving the processing performances, such as patterning resolution, processing speed, electrical conductivity, etc., on smooth surfaces, such as glass and polymer films − (Supporting Information 4). Furthermore, the CW laser source of 1070 nm wavelength used herein is more accessible than visible wavelength lasers or ultrashort pulse lasers in other studies. , To evaluate the uniformity of the electrode, a microscopic image was taken, and the width on the five points of every electrode line was measured (Supporting Information 5).…”

Section: Resultsmentioning

confidence: 99%

“…Previously reported studies have focused on improving the processing performances, such as patterning resolution, processing speed, electrical conductivity, etc., on smooth surfaces, such as glass and polymer films − (Supporting Information 4). Furthermore, the CW laser source of 1070 nm wavelength used herein is more accessible than visible wavelength lasers or ultrashort pulse lasers in other studies. , To evaluate the uniformity of the electrode, a microscopic image was taken, and the width on the five points of every electrode line was measured (Supporting Information 5). The average pattern width and standard deviation were 9.81 and 0.99 μm, respectively.…”

Section: Resultsmentioning

confidence: 99%

“…Furthermore, the CW laser source of 1070 nm wavelength used herein is more accessible than visible wavelength lasers or ultrashort pulse lasers in other studies. 36,40 To evaluate the uniformity of the electrode, a microscopic image was taken, and the width on the five points of every electrode line was measured (Supporting Information 5). The average pattern width and standard deviation were 9.81 and 0.99 μm, respectively.…”

Section: ■ Results and Discussionmentioning

confidence: 99%

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Rapid Electronic Interconnection Across the Glass Boundary Edge for Sustainable and Lean Electronics Manufacturing

Kwon

Kang

Back

et al. 2020

ACS Sustainable Chem. Eng.

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Herein, a rapid, eco-friendly, digital printing method is proposed for directly interconnecting individual electronics formed on the front and back planes of glass substrates, across the boundary edge, to obtain bezel-and soldering-free monolithic electronics. Laser filament scanning sintering, which is characterized by rapid scanning with a long and narrow laser spot with an aspect ratio of 500, allows for the selective formation of the electrode along the glass edge without pattern fluctuation. In this study, a novel dual-mode concurrent sintering interaction using a NIR laser filament beam, whereby nanoparticle sintering begins from the outer surface and the interface with the substrate, facilitates the device fabrication with high-resolution electrodes of 10 μm width on very rough and steeply curved edge surfaces at an ultrahigh speed of 3 m/s. This outstanding performance is accomplished by the combination of the effect of mild surface absorption of the NIR laser by a layer of Ag nanoparticles (1st mode) and intensive near-field surface scattering of the transmitting laser light (2nd mode). To intuitively demonstrate the feasibility of sustainable manufacturing of monolithic electronics, we successfully fabricated a workable bezel-and soldering-free LED panel, energy-supplied by a battery mounted on the rear plane, without the use of additional interconnection components.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Section: ■ Results and Discussionmentioning

confidence: 99%

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Rapid Electronic Interconnection Across the Glass Boundary Edge for Sustainable and Lean Electronics Manufacturing

Kwon

Kang

Back

et al. 2020

ACS Sustainable Chem. Eng.

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“…This is attributed to the different laser wavelengths used. The surface became smoother when the wavelength increased, since both the growth sintering interaction and organic evaporation progress in a more stable manner due to the relatively low absorption property of longer wavelength. ,, Therefore, irradiating a laser with a 1070 nm wavelength on the hybrid suspension is suitable for achieving an optically smooth surface according to the laser sintering of hybrid suspension . However, the scanning rate of the typical laser sintering method using a 1070 nm wavelength is limited to 25 mm/s; otherwise, the LSL method improves the scan rate and sintering efficiency because shorter wavelength leads to higher laser absorption by the hybrid suspension.…”

Section: Resultsmentioning

confidence: 99%

Laser Sweeping Lithography: Parallel Bottom-up Growth Sintering of a Nanoseed–Organometallic Hybrid Suspension for Ecofriendly Mass Production of Electronics

Yun

Yang

Kang

2018

ACS Sustainable Chem. Eng.

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We present a novel laser sweeping lithography (LSL) process, revolving around an ecofriendly mass production method, to fabricate conductive patterns in parallel with no restriction on the type of substrate. Particle-free organometallic solution is reformulated inprocess into a nanoseed−organometallic hybrid suspension, via an incomplete thermal decomposition using radiative heating. The growth sintering undergoing a series of ion precipitation, clustering, growing, and agglomeration procedures is then initiated by irradiating a linemodulated diode laser of a near-infrared wavelength through a thermally enforced laser mask on the hybrid suspension. This leads to the concurrent parallel production of silver conductors with a high-conductivity (2.9 μΩ•cm), durability, and resolution of 5 μm on the corresponding to mask openings, without the need of any additional steps and corrosive chemicals. This method is highly effective for large-area fabrication of high-density electronics, as the production time proportionally decreases with increased pattern density and area, compared to conventional laser fabrication methods based on a single laser spot. Therefore, the LSL process is suitable for ecofriendly mass production of various electronic devices in industrial environments.

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“…The typical cost of the mask fabrication is rather affordable, depending on the resolution and can vary between USD 100 and USD 1000. The mask could be produced much more cheaply [ 42 , 43 ] if a

m resolution is not crucial.…”

Section: Discussionmentioning

confidence: 99%

Micromask Lithography for Cheap and Fast 2D Materials Microstructures Fabrication

et al. 2021

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The fast and precise fabrication of micro-devices based on single flakes of novel 2D materials and stacked heterostructures is vital for exploration of novel functionalities. In this paper, we demonstrate a fast high-resolution contact mask lithography through a simple upgrade of metallographic optical microscope. Suggested kit for the micromask lithography is compact and easily compatible with a glove box, thus being suitable for a wide range of air-unstable materials. The shadow masks could be either ordered commercially or fabricated in a laboratory using a beam lithography. The processes of the mask alignment and the resist exposure take a few minutes and provide a micrometer resolution. With the total price of the kit components around USD 200, our approach would be convenient for laboratories with the limited access to commercial lithographic systems.

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Low-cost laser printable photomask: One-step, photoresist-free, fully solution processed high-grade photolithography mask

Cited by 13 publications

References 24 publications

Rapid Electronic Interconnection Across the Glass Boundary Edge for Sustainable and Lean Electronics Manufacturing

Rapid Electronic Interconnection Across the Glass Boundary Edge for Sustainable and Lean Electronics Manufacturing

Laser Sweeping Lithography: Parallel Bottom-up Growth Sintering of a Nanoseed–Organometallic Hybrid Suspension for Ecofriendly Mass Production of Electronics

Micromask Lithography for Cheap and Fast 2D Materials Microstructures Fabrication

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