Low Cost Packages for Micro- and Millimeterwave Circuits

Boheim, M.; Goebel, U.

doi:10.1109/euma.1994.337203

Cited by 11 publications

(4 citation statements)

References 2 publications

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“…In general, ball bonding is a very simple and effective interconnection technology for the fabrication of optical module, but the 40-Gb/s EML module operates at ultrahigh frequency. In the frequency range, a discontinuity introduced by the bonding wires can limit their performance as dominant parasitics in spite of its small physical length [12], [13]. For this reason, to optimize the interconnection method, we fabricated the device under test (DUT), as shown in Fig.…”

Section: B Package Structures and Characteristicsmentioning

confidence: 99%

Fabrication and Characteristics of 40-Gb/s Traveling-Wave Electroabsorption Modulator-Integrated DFB Laser Modules

Yun

Choi

Kwon

et al. 2008

IEEE Trans. Adv. Packag.

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We have developed 40-Gb/s traveling-wave electroabsorption-modulator-integrated distributed feedback laser (TW-EML) modules using several advanced technologies. First, we have adopted a selective area growth (SAG) method in the fabrication of the 40-Gb/s EML device to provide active layers for the laser and the electroabsorption modulators (EAMs) simultaneously. The fabricated device shows that the measured 3-dB bandwidth of electrical-to-optical (E/O) response reaches about 45 GHz and the return loss ( 11 ) is kept below 10 dB up to 50 GHz. For the module design of the device, we mainly considered electrical and optical factors. The measured S 11 of the fabricated 40 Gb/s TW-EML module is below 10 dB up to about 30 GHz and the 3-dB bandwidth of the E/O response reaches over 35 GHz. We also have developed two types of coplanar waveguide (CPW) for the application of the driver amplifier integrated 40 Gb/s TW-EML module, which is a system-on-package (SoP) composed of an EML device and a driver amplifier device in a module. The measured 11 of the two-step-bent CPW is below 10 dB up to 35 GHz and the measured 11 of the parallel type CPW is below 10 dB up to 39 GHz.

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Section: B Package Structures and Characteristicsmentioning

confidence: 99%

Fabrication and Characteristics of 40-Gb/s Traveling-Wave Electroabsorption Modulator-Integrated DFB Laser Modules

Yun

Choi

Kwon

et al. 2008

IEEE Trans. Adv. Packag.

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“…Metal inserts are used to remove heat from active areas. Liquid crystal polymers with their anisotropic behaviour may be of interest for a low thermal expansion in one plane [5]. Special care has to be taken using plastic materials with respect to hermeticity; in most cases, a metallisation will be used to keep penetration of vapour low enough; this improves, at the same time, the electromagnetic shielding of the package.…”

Section: Package Materialsmentioning

confidence: 99%

“…At lower frequencies, leadframes are used as stabilizing elements [6]. As a relative stable material for packages, polymers with special fillings of ceramic powder, glass or carbon fibers or even metal powder have been investigated [5]. These composite materials are engineered for high stability and low thermal expansion, they can withstand temperatures up to 200" C, and they may be easily fabricated employing powder or metal injection techniques.…”

Section: Package Materialsmentioning

confidence: 99%

“…To enable some imaging of the street in front of the car, three waveguide feed horns for three different antenna beam anglles alternatively illuminate a dielectric lens.All circuits are rlealized as MIMICS, placed side by side on a carrier plate made from a plastic compound. The mm-wave interconnects arc done by compensated bonds[5], the transitions from microstrip to waveguide according [ 113. The heat generated by the active elements is removed by a metal insert in the carrier plate.…”

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Interconnects and packaging of millimeter wave circuits

Menzel¹

1997 Topical Symposium on Millimeter Waves. Proceedings (Cat. No.97TH8274)

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This contribution presents a number of aspects relevant for interconnects and packaging of monolithic integrated circuits, possibly combined with hybrid or even waveguide circuits in the millimeter-wave range. Examples of different iinterconnects and two realized front-ends are demonstrated. L INTRODUCTIONIn recent years, great efforts have been undertaken to develop mm-wave monolitluc integrated circuits (MIMICS) which now are being introduced into radar [l], [8] and communication equipment [2]. Especially for low cost civil systems, however, there is still a lack of suitable and affordable techniques for interconnects and packaging of MIMICS, possibly together with hybrid integrated circuits or even waveguide. Packaging of micro-and mm-wave MICs, MMICs, components or subsystems has to provide protection against mechanical !;tress, environmental loads like moisture and chemicals, and, in some cases, against electromagnetic interferences (Em). In addition, the complete assembly must operate in a wide temperature range, and it must allow the removal of heat generated in its interior [3] - [7]. Equally, packaging includes interconnects between different circuits (possibly between different types of transfnission lines, too), feed-through elements into and out of the package, choice of materials, or front-end architecture. With increasing mass applicatioris like phased arrays [4], [SI or &HIC applications [ 11, packages have to be fabricated and assembled easily and quickly based on reliable processes at reasonable cost. All these problems are increasingly relevant for applications at mm-wave frequencies. Therefore, this contribution will address topics like front-end architecture for mm-wave circuits based on different transmission line media, package materials, circuit interconnects, feed-through elements, and two approaches, for front-end packaging. PACKAGING AND FRONT-END ARCHITECTUREWhile at lower frequencies, single devices or single MMICs are placed into a package, this mostly is not effective at millimeter wave frequencies. Even a single MIMIC is no longer small compared to wavelengths resulting in package resonance problems, and the cumulating effects of the interconnects from the MIMIC to the package feed-through, out of the package and from one packaged component to the other will add to high insertion and return losses. Therefore, carefully designed assemblies of MIMICS, passive components, radiating structures and other elements have to be combined to subsystems or "supercomponents" and will be placed together on a metal or dielectric carrier, shielded by a single package with special precautions against package resonances. Two examples for this will be presented in section VI. The (combination of components will be determined by good functionality, short interconnects for low noise figure or low loss in transmitter power paths, low number of package feed-through elements, limitation of interferences between single components, limitation of gain within one package (feedback prevention), sufficient remov...

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Packaging and interconnects for millimeter wave circuits : A review

Menzel

1997

Ann. Télécommun.

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Low Cost Packages for Micro- and Millimeterwave Circuits

Cited by 11 publications

References 2 publications

Fabrication and Characteristics of 40-Gb/s Traveling-Wave Electroabsorption Modulator-Integrated DFB Laser Modules

Fabrication and Characteristics of 40-Gb/s Traveling-Wave Electroabsorption Modulator-Integrated DFB Laser Modules

Interconnects and packaging of millimeter wave circuits

Packaging and interconnects for millimeter wave circuits : A review

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