2011
DOI: 10.1021/jp204189k
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Low-Energy Electron-Induced Decomposition and Reactions of Adsorbed Tetrakis(trifluorophosphine)platinum [Pt(PF3)4]

Abstract: Electron-beam-induced deposition (EBID), also referred to as focused electron-beam-induced processing (FEBIP), is a lowvacuum materials processing technique in which a focused electron beam is used to directly write nanometer-sized structures onto a substrate in a constant partial pressure of precursor molecules. 1À4 EBID has a unique and attractive combination of capabilities, including high spatial resolution and the flexibility to deposit self-supporting three-dimensional nanostructures on nonplanar surface… Show more

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Cited by 62 publications
(112 citation statements)
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“…This step ensures that the effect of substrate temperature provides information only on the fate of those nonvolatile species deposited on the surface by electron beam reactions with the precursor. To accomplish this goal we have taken advantage of information acquired in our previous UHV studies, 16,19 which indicate that the initial electron induced reaction of the three precursor molecules [MeCpPtMe 3 , Pt(PF 3 ) 4 , and W(CO) 6 ] involves the ejection of gas phase CH 4 , PF 3 , and CO species, respectively. In typical EBID experiments this initial electron stimulated reaction corresponds to the electron stimulated deposition event that converts the transiently adsorbed precursor molecule into a surface bound species.…”
Section: Resultsmentioning
confidence: 99%
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“…This step ensures that the effect of substrate temperature provides information only on the fate of those nonvolatile species deposited on the surface by electron beam reactions with the precursor. To accomplish this goal we have taken advantage of information acquired in our previous UHV studies, 16,19 which indicate that the initial electron induced reaction of the three precursor molecules [MeCpPtMe 3 , Pt(PF 3 ) 4 , and W(CO) 6 ] involves the ejection of gas phase CH 4 , PF 3 , and CO species, respectively. In typical EBID experiments this initial electron stimulated reaction corresponds to the electron stimulated deposition event that converts the transiently adsorbed precursor molecule into a surface bound species.…”
Section: Resultsmentioning
confidence: 99%
“…19 More prolonged electron exposures cause electron stimulated P-F bond cleavage within the Pt(PF 3 ) 3 . 19 This was verified experimentally by ensuring the intensity in the P(2p) region had decreased to 75% of the value measured after Pt(PF 3 ) 4 adsorption, and before the onset of electron irradiation.…”
Section: B Pt(pf 3 )mentioning
confidence: 99%
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“…To our knowledge, however, DEA has to date not been accounted for in MC simulations dealing with FEBID, and although it is clear that further studies are necessary to confirm their relevance and especially how the DEA processes are influenced by the supporting surface, recent investigations indicate strongly that DEA may play a pivotal role in FEBID. [21][22][23][24][25]46 In particular, this applies to the purity of the deposit and the broadening of the deposits beyond the diameter of the electron beam, which are currently the main challenges that need to be addressed to further enhance the applicability of FEBID as a standard tool in nano-fabrication. Like DEA, absolute cross sections for DI of relevant FEBID precursor molecules are scarce.…”
Section: No]mentioning
confidence: 99%
“…7,20 At those energies, dissociative electron attachment (DEA) is the only efficient fragmentation mechanism and, in that context, its potential role in FEBID has been discussed in some detail. [21][22][23][24][25] Although DEA is the only effective electron induced dissociation mechanism below the ionization limit of the respective molecules, SEs and BSEs, with incident energies close to and above the ionization limit of the respective molecules, can also cause fragmentation through dissociative ionization (DI). This is a non-resonant process, but can nonetheless be very efficient at fairly low incident energies (typically, in the range 10-50 eV).…”
Section: Introductionmentioning
confidence: 99%