2011
DOI: 10.1002/app.34327
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Low formaldehyde emission particleboard panels realized through a new acrylic binder

Abstract: ABSTRACT:The effectiveness of acrylic resins as low formaldehyde emission binders for particleboard production was explored. In particular, a multifunctional methacrylic monomer, ethoxylated bisphenol A dimethacrylate, classified as nonskin and eyes irritant, was selected and tested. In comparison panels realized with classic ureaformaldehyde (UF) binder were also prepared. No significant differences were found through the morpholocigal analysis of samples prepared with the two different binders. Moreover, par… Show more

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Cited by 26 publications
(15 citation statements)
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References 46 publications
(40 reference statements)
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“…Over the past years, several approaches have been taken to reduce formaldehyde emissions from wood-based panels. This includes using liquefied wood (LW), wood meal of black poplar liquefied with a mixture of glycerol and sulfuric acid by heating, for the modification of phenolformaldehyde (Antonovic et al 2010), organosolv lignin dispersion to partially replace the solids content in a liquid phenol-formaldehyde (Seyno et al 1996), hydrogen peroxide as a catalyst in the hardening process of urea-formaldehyde (Elbert 1995), low formaldehyde emission acrylic resin (Amazio et al 2011), and pulp and paper secondary sludge as a ureaformaldehyde co-adhesive (Xing et al 2013). A number of studies focused on the replacement of formaldehyde-based resins with other binders such as epoxidized vegetable oils (Sivasubramanian et al 2009;Tasooji et al 2010), soy-based adhesives (Prasittisopin and Li 2010), tannins and lignin from pulp mill residues (Bertaud et al 2012), and polymeric diphenylmethane diisocyanate (pMDI) (Tongboon et al 2002).…”
Section: Introductionmentioning
confidence: 99%
“…Over the past years, several approaches have been taken to reduce formaldehyde emissions from wood-based panels. This includes using liquefied wood (LW), wood meal of black poplar liquefied with a mixture of glycerol and sulfuric acid by heating, for the modification of phenolformaldehyde (Antonovic et al 2010), organosolv lignin dispersion to partially replace the solids content in a liquid phenol-formaldehyde (Seyno et al 1996), hydrogen peroxide as a catalyst in the hardening process of urea-formaldehyde (Elbert 1995), low formaldehyde emission acrylic resin (Amazio et al 2011), and pulp and paper secondary sludge as a ureaformaldehyde co-adhesive (Xing et al 2013). A number of studies focused on the replacement of formaldehyde-based resins with other binders such as epoxidized vegetable oils (Sivasubramanian et al 2009;Tasooji et al 2010), soy-based adhesives (Prasittisopin and Li 2010), tannins and lignin from pulp mill residues (Bertaud et al 2012), and polymeric diphenylmethane diisocyanate (pMDI) (Tongboon et al 2002).…”
Section: Introductionmentioning
confidence: 99%
“…The thermoplastic acrylic polymer can be transformed into a thermosetting film adhesive (Gouri et al 2001). Acrylic resin with dibenzoylperoxide as catalyst provides a multifunctional methacrylic monomer (ethoxylated bisphenol A dimethacrylate) which was successfully tested on particleboards (Amazio et al 2011). The addition of an acrylic emulsion generally leads to lower formaldehyde emissions and lower swelling of the boards than a urea formaldehyde adhesive (Amazio et al 2011;Dziurka and Łȩcka 2004).…”
Section: Adhesives Suitable For Surfaces Of Monocotyledonsmentioning
confidence: 99%
“…Acrylic resin with dibenzoylperoxide as catalyst provides a multifunctional methacrylic monomer (ethoxylated bisphenol A dimethacrylate) which was successfully tested on particleboards (Amazio et al 2011). The addition of an acrylic emulsion generally leads to lower formaldehyde emissions and lower swelling of the boards than a urea formaldehyde adhesive (Amazio et al 2011;Dziurka and Łȩcka 2004). Acrylated epoxidised soy oil (AESO) was successfully used as adhesive to produce particleboards of wheat straw (Shakeri et al 2010;Tasooji et al 2010).…”
Section: Adhesives Suitable For Surfaces Of Monocotyledonsmentioning
confidence: 99%
“…Methods for reducing FE in wood-composite materials have been widely discussed over the years, and many of them have been described in [3]. However, a decrease in the formaldehyde content of the resins may impair the bonding strength, and adhesives without formaldehyde can increase the cost of the plywood [4,5].…”
Section: Introductionmentioning
confidence: 99%